Electronic System Design (ESD) industry revenue increased 17.5% from $3,191.4 million in Q2 2021 to $3,748.7 million in Q2 2022, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
Design
QCI Launches Project to Build and Operate New Quantum Computing Optical Chip Manufacturing and Research Facility
Quantum Computing Inc. announced plans to construct and operate a new quantum nanophotonics technology manufacturing and research center to expand its current chip development capabilities.
Weebit Nano Advances its ReRAM Selector Development to Fit Embedded & Discrete Applications
Weebit Nano Limited, a developer of next-generation memory technologies for the global semiconductor industry, has made significant progress in its selector development with new results confirming its ReRAM selector is suitable for both embedded and discrete (stand-alone) applications, greatly increasing the number of possible applications for Weebit’s technology.
What’s in the October Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the October issue. If you are attending SEMICON Europa stop by the publication bins and pick up a copy in print!
Lockheed Martin, Ayar Labs Partner to Advance Microchip Connectivity for Next Generation Sensory Systems
Lockheed Martin, (NYSE: LMT) and Ayar Labstoday announced a strategic collaboration to develop future sensory platforms that leverage Ayar Labs’ advanced optical I/O microchips that use light to transfer data faster, at a lower latency, and at a fraction of the power of existing electrical I/O solutions.
New Cadence Certus Delivers Up to 10X Faster Concurrent Full-Chip Optimization and Signoff
Cadence Design Systems, Inc. today announced the new Cadence Certus Closure Solution to address growing chip-level design size and complexity challenges.
Can Binary or Ternary Compounds Beat Cu in Future Interconnect Applications?
A unique methodology to explore alternative interconnect metals for the Ångström era.
CyberOptics to Feature Yield-Improving Auto Teaching Systems during SEMICON Europa
The company will feature its next-generation WaferSense Auto Teaching System (ATS2), the new ReticleSense Auto Teaching System (ATSR) and the In-Line Particle Sensor in Booth #C1101.
Promex Expands Die Bonding Capacity, Adds New Capabilities
Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has completed the first phase of its plan to expand its die bonding services.
Powering the Quantum Leap
The role of cryogenic wafer probing in applications such as cryogenic quantum computing and supra-conductive CMOS semiconductors, where temperatures near absolute zero are essential, is discussed.
