Arteris, Inc., a provider of system IP which accelerates system-on-chip (SoC) creation, today announced that Joachim Kunkel will join its Board of Directors.
Design
Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave
The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program.
Dr. Jason Cong to be Honored With 2024 Phil Kaufman Award
Dr. Jason Cong, Distinguished Professor and Volgenau Chair for Engineering Excellence at the University of California, Los Angeles (UCLA), will be honored with the 2024 Phil Kaufman Award for distinguished contributions to Electronic System Design (ESD).
Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
Synopsys, Inc. today announced the industry’s first complete UCIe IP solution operating at up to 40 Gbps per pin to address the increased compute performance requirements of the world’s fastest AI data centers.
What’s in the August/September Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the August/September issue.
Intel Names New Representative to Si2 Board
Intel has a new representative on the Silicon Integration Initiative board of directors.
Electrically Modulated Light Antenna Points the Way to Faster Computer Chips
Today’s computers reach their physical limits when it comes to speed. Semiconductor components usually operate at a maximum usable frequency of a few gigahertz – which corresponds to several billion computing operations per second.
EDA and IP Industries Face Dickensian Quandary – Will Value Win Over Complacency?
Fundamental changes are changing the value of EDA and IP, but not for the better. Will AI be the game changer?
Micron Introduces HBM3E 12-high 36GB
Micron’s HBM3E 12-high 36GB delivers significantly lower power consumption than other 8-high 24GB offerings, despite having 50% more DRAM capacity in the package.
DELO Introduces New Microelectronics Adhesive for Ultra-Fine Structures
DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds.
