Georgia Institute of Technology has been selected as a key collaborator in producing a roadmap for the future of advanced packaging for next generation microelectronics.
Design
An Efficient Electrochemical Intercalation Method for High-Yield Production of TMD Nanosheets
Two-dimensional (2D) transition metal dichalcogenides (TMDs), an emerging class of materials that can be used as semiconductors and insulators, have promising potential in various applications due to their unique properties.
Quantum Brilliance Establishes Research Hub with La Trobe University and RMIT University to Accelerate Development of Diamond-based Quantum Computers
Research Hub for Diamond Quantum Materials will develop new fabrication methods for quantum microprocessors to increase computational power and enable mass-manufacturing of devices.
PragmatIC Semiconductor Unveils Plans for New UK Site
PragmatIC Park set to be a centre of excellence for flexible electronics design and manufacturing.
ZEISS to Host and Live Stream Ribbon Cutting Event at the Microscopy Customer Center Bay Area in Dublin, California
ZEISS announces it will host a ribbon cutting event at its ZEISS Microscopy Customer Center Bay Area (ZMCC BA), housed within the ZEISS Innovation Center California, a high-tech building designed to promote customer and employee collaboration, in Dublin, CA.
Nominations Open for Phil Kaufman Hall of Fame Sponsored by ESD Alliance and IEEE CEDA
Nominations opened today for the Phil Kaufman Hall of Fame for Distinguished Contributions to Electronic System Design sponsored by the Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation(CEDA).
Electronic System Design Industry Logs 14.4% Year-Over-Year Revenue Growth in Q4 2021, ESD Alliance Reports
Electronic System Design (ESD) industry revenue increased 14.4% from $3,031.5 million in Q4 2020 to $3,468.2 million in Q4 2021, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development
Faraday Technology Corporation, ASIC design service and IP provider, today launched SoCreative!VI A600 SoC development platform implemented in Samsung Foundry’s 14LPP FinFET process technology.
Intel to Acquire Granulate
Intel Corporation today announced an agreement to acquire Granulate Cloud Solutions Ltd., an Israel-based developer of real-time continuous optimization software.
Cognifiber Downsizes its System for Edge Computing With Breakthrough Glass Processors
Cognifiber, a deep technology company focusing on revolutionizing photonic computing, announced the development of a glass-based photonic chip that will bring its technology one step closer to revolutionizing edge computing.
