In the future, decarbonized societies that use internet of things (IoT) devices will become commonplace.
Design
Researchers Fabricate Large-Area Sky-Blue PeLEDs
The research group led by Prof. XIAO Zhengguo from the University of Science and Technology of China (USTC) of the Chinese Academy of Sciences prepared large-area and efficient sky-blue perovskite light-emitting diodes (PeLEDs) by blade-coating supersaturated perovskite solution.
Tektronix Publishes Key Insights from its First Ever 2022 Calibration Services Trend Survey
Tektronix, Inc., today published and announced the availability of its first ever 2022 Calibration Services Trend Survey.
The 2022 IEEE International Reliability Physics Symposium to Showcase Latest Original Research in Reliability for Semiconductor Devices, Integrated Circuits, and Microelectronic Systems with a Hybrid Conference
The upcoming 2022 IEEE International Reliability Physics Symposium (IRPS) will be held as an in-person event with a virtual component from March 27 – 31, 2022 at the Hilton DFW Lakes Executive Conference Center in Grapevine, TX.
DVCon U.S. 2022 Announces Stuart Sutherland Best Paper & Best Poster Winners
The 2022 virtual Design and Verification Conference and Exhibition U.S. (DVCon U.S.), sponsored by Accellera Systems Initiative (Accellera), concluded its 34th annual event last week.
New Research from Pusan National University Sheds Light on Nature of Friction in Multi-layered Graphene
New study provides insights into how surface structures influence nanoscale friction in this promising 2D material.
ASMC 2022 to Spotlight Advanced Semiconductor Manufacturing Excellence
Advanced semiconductor manufacturing topics ranging from yield management and metrology to new developments in improving post-pandemic manufacturing agility will come into sharp focus at SEMI Advanced Semiconductor Manufacturing Conference.
Women in Semiconductors 2022 to Highlight Women in Leadership and STEM Talent Pipeline
The vital importance of workplace inclusion and diversity to the growth of the global semiconductor industry will take center stage as the Women in Semiconductors (WiS) program returns in-person on May 2 in conjunction with the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2022) in Saratoga Springs, New York.
Breker Verification Systems Unleashes the SystemUVM Initiative to Empower UVM Engineering
Breker Verification Systems used the opening of DVCon U.S. today to unveil SystemUVM, a framework designed to simplify specification model composition for test content synthesis with a UVM/SystemVerilog syntactic and semantic approach familiar to universal verification methodology (UVM) engineers.
Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem
Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.
