Agreement aims to build and strengthen a collaborative model to accelerate the next wave of innovation in automotive chip design.
Design
Common Vulnerability and Exposures (CVE) Program Adds Silicon Labs as CVE Numbering Authority (CNA)
Silicon Labs (NASDAQ: SLAB) today announced it has been added as a Common Vulnerability and Exposures (CVE) Numbering Authority (CNA) by the CVE Program, allowing Silicon Labs to proactively assign identifiers to common vulnerabilities and exposures in accordance with cybersecurity standards.
Watlow’s Facility in Winona, MN Selected as Business of the Year
Watlow, a designer and manufacturer of complete thermal systems, announced that its facility in Winona, MN was selected by the Winona Chamber of Commerce as ‘Business of the Year.’
Watlow New STREAMLINE Heating System with ATS Technologies Reduces the Complexity Associated with Legacy Systems on a Semiconductor Tool
Watlow, a designer and manufacturer of complete thermal systems, announced the launch of its new STREAMLINE Heating System featuring Adaptive Thermal Systems (ATS) technologies.
SUSS MicroOptics Wins the Swiss Manufacturing Award 2021
The University of St. Gallen in Switzerland recognizes SUSS MicroOptics with the “Swiss Manufacturing Award” for its outstanding contribution to Switzerland’s manufacturing ecosystem.
Atonarp Announces Advisory Council of Science and Technology Experts to Boost Development of Digital Molecular Profiling
Atonarp, developer of digital molecular profiling instrument platforms and software applications for healthcare and industrial markets, announced today the establishment of its first strategic Advisory Council, consisting of nine distinguished science and technology industry leaders.
Fraunhofer ENAS Successfully Manufactures Ultra-Thin and Highly Flexible Parylene-Based Printed Circuit Boards with Several Metallization Layers
Scientists at the Fraunhofer Institute for Electronic Nano Systems ENAS in Chemnitz successfully developed and manufactured flexible printed circuit boards with an overall thickness of less than 20 micrometers and several metallization layers based on the polymer Parylene. The institute presents the new generation of flexible PCB this fall at the COMPAMED and the SEMICON Europa 2021.
Renesas Expands Satellite Communications Portfolio with Industry’s First Commercial Dual-Beam Active Beamforming IC Lineup
Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today expanded its portfolio of mmWave LNAs and Tx BFICs with the introduction of three new dual-beam active beamforming ICs.
Classiq Unveils Groundbreaking Capabilities for Its Quantum Algorithm Design Platform
Users can now integrate proprietary functionality with extensive pre-written functional models to create sophisticated and optimized quantum circuits that could not be designed otherwise.
Smart Textiles: High Performance, Breathable Fabric to Power Small Electronics
Scientists have created a new triboelectric fabric that generates electricity from the movement of the body while remaining flexible and breathable.
