Intel will invest more than $20 billion to build two new factories and to establish a new epicenter for advanced chipmaking in the Midwest.
Design
NUS Research Team Sets New Efficiency Record for Solar Cell Technology
Their solar cells made using perovskite and organic materials achieve a power conversion efficiency of 23.6%, approaching that of conventional silicon solar cells.
Secure-IC Raises €20M to Accelerate the Development of Its Cybersecurity Solutions for Connected Objects
After 10 years of sustained and controlled growth on equity, Secure-IC, a provider of end-to-end cybersecurity solutions for embedded systems and connected objects announced today a first capital raising of 20 million euros.
U.S. Is Keystone of the World’s Science and Engineering Ecosystem
In ecological science, a keystone species is essential to the entire ecosystem. Weaken or remove a keystone and it impacts everything else. The National Science Board’s The State of U.S. Science and Engineering 2022 published today, shows that for the world’s science and engineering (S&E) ecosystem, the U.S. is such a keystone.
EnSilica and Omni Design Collaborating on Multiple SoCs
Omni Design Technologies, a provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions, and EnSilica, a provider of custom ASIC design and supply solutions, today announced that they have entered into a partnership agreement.
2022 Semiconductor Materials Outlook: COVID-19 Pandemic Still Having Lasting Effects on All Materials
The COVID-19 pandemic has created strong demand for both logic and memory ICs to support continued Work from Home and School from Home, and as such demand is expected to increase despite expanding availability of virus vaccines.
Electronic System Design Industry Logs 17% Year-Over-Year Revenue Growth in Q3 2021, ESD Alliance Reports
Electronic System Design (ESD) industry revenue increased 17.1% year-over-year from $2,953.9 million to $3,458.1 million in Q3 2021, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
New IDC Spending Guide Forecasts Double-Digit Growth for Investments in Edge Computing
Worldwide spending on edge computing is expected to be $176 billion in 2022, an increase of 14.8% over 2021.
DuPont To Launch Pyralux HP Laminate Adhesive System for High-Performance Electronics
DuPont Interconnect Solutions (ICS), a business within the Electronics & Industrial segment, will introduce the Pyralux HP laminate adhesive system at the 2022 Institute for Printed Circuits (IPC) APEX Exposition to be held in San Diego, CA from January 25 – 27, 2022.
Toshiba Opens the Way to Longer Life Wearables and IoT Devices With New IC Chips
Minute, ultra-low quiescent current load switch ICs yield huge performance improvements.
