Company plans to increase U.S. investment in advanced semiconductor manufacturing by $100 billion with three new fabs, two advanced packaging facilities and an R&D center added to U.S. plans.
Editor’s Picks
Micron Announces Shipment of 1γ (1-gamma) DRAM
Micron delivers superior performance and power efficiency to data center, client and mobile platforms with the industry’s first high performance 1γ node.
Microsoft Unveils Majorana 1, The World’s First Quantum Processor Powered by Topological Qubits
Built with a breakthrough class of materials called a topoconductor, Majorana 1 marks a transformative leap toward practical quantum computing.
Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
What’s in the January/February Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the January/February issue.
Ex-TSMC Exec Urges Stronger Taiwan-U.S. Cooperation Amid Chip Tariff Threat
If the United States imposes tariffs on Taiwan-made semiconductors, Taiwan should work actively to enhance industrial cooperation with the U.S. to mitigate potential impacts, according to a former executive at Taiwan Semiconductor Manufacturing Co. (TSMC).
Global Semiconductor Sales Increase 19.1% in 2024; Double-Digit Growth Projected in 2025
Sales hit highest-ever yearly total in 2024.
Leveraging Agile Practices in Chip Design for Enhanced Compliance and Reliability
Implementing practices inspired by Agile way or working into chip design processes offers substantial benefits in enhancing compliance and reliability.
How LTE-M Outperforms Other Technologies in Asset Tracking
The choice of connectivity technology plays a decisive role in the success of tracking assets anywhere in the world.
Modeling Techniques to Speed up Simulation and Emulation in Complex Mixed Signal Devices
A new technique yielded a much better filter response, where the current to charge information was well preserved and also reduced filter complexity. This solution leads to less computations and events for the simulator to process, in turn speeding up the simulation.
