Editor’s Picks

Accelerating AI-Defined Cars

Expect to see a convergence of edge computing, machine vision and 5G-connected vehicles.

IBM Unveils World’s First 2 nm Chip Technology

IBM announced a breakthrough in semiconductor design and process with the development of the world’s first chip announced with 2 nm nanosheet technology. The new design is projected to achieve 45 percent higher performance and 75 percent lower energy use than today’s 7 nm chips. It will likely not be in production until 2024.

Q1 Global Semiconductor Sales Increase 3.6% Over Previous Quarter

Worldwide sales for March increase 17.8% year-to-year, 3.7% month-to-month.

Fabless Suppliers Held a Record 33% of the 2020 IC Market

Fabless IC suppliers registered a strong 24% surge in sales last year as compared to only an 8% increase by the IDMs.

Chinese Companies Hold Only 5% of Global IC Marketshare

Propelled by 50% share of IDM sales and 64% share of fabless sales, U.S. companies captured 55% of the total worldwide IC market in 2020.

Intel Steps Up Hiring in Taiwan to Secure Semiconductor Chips Supply Chain for PC Partners

Intel Corporation is ramping up hiring activity globally but more so in Taiwan.

Semiconductor Units Forecast To Exceed 1 Trillion Devices Again in 2021

A 13% increase is expected to lift total semiconductor shipments to a new record high.

Optoelectronics, Sensors/Actuators, and Discretes Gain Momentum

Total O-S-D sales set a record high in 2020 despite the Covid-19 virus crisis wrecking the global economy. In a 2021 rebound, optoelectronics is expected to join sensors/actuators and discretes in strong growth.

Mid-Infrared Optical Metrology for High Aspect Ratio Holes in 3D NAND Manufacturing

Infrared critical dimension metrology (IRCD) addresses the shortcomings of conventional ultraviolet to near-infrared OCD in channel hole etch high-fidelity z-profile and amorphous carbon hardmask etch BCD metrology.

TSMC’s Technology Roadmap

Mark Liu, Chairman of Taiwan Semiconductor Manufacturing Company (TSMC), provided detailed insights into the company’s technology roadmap at the recent International Solid-State Circuits Conference (ISSCC). He waved off the suggestion that device technology improvements are slowing down.

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