A look inside YMTC’s second-generation 3D-NAND technology, which uses “Xtacking” to bond the peripheral circuitry face-to-face with the memory array instead of alongside.
Editor’s Picks
VLSI Design Optimization and Validation Process Is Like Painting the Forth Bridge
Some EDA tools have introduced an innovative approach that allows designers to generate design metadata one time for certain verification flows.
Understanding Cooling and Particulate Contamination Challenges for Next Generation ALE Technologies
Mixed-refrigerant Joule-Thomson refrigeration can provide the necessary wafer temperatures and cooling power with smaller footprint, better reliability and lower power consumption than alternative cooling technologies. Cryo-trapping can reduce particle generation by removing the water that mediates the particle formation process.
Building Patterns From The Bottom: A Complementary Approach to Lithography
With shrinking dimensions, the classical lithography-based top-down patterning processes are becoming extremely complex and expensive. Therefore, researchers worldwide are investigating alternative processes allowing to build patterns from the bottom. Two promising approaches are directed self-assembly (DSA) and area-selective deposition (ASD).
Deep Learning at the Extreme Edge: A Manifesto
With continuous voltage and frequency scaling, the logic is self-timed, adjusting core voltage and clock frequency automatically, ensuring no timing violation. This allows the chip to always run the most efficient way for a given workload.
Samsung Begins Mass Production of 16Gb LPDDR5 DRAM at World’s Largest Semiconductor Line
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that its second production line in Pyeongtaek, Korea, has commenced mass production of the industry’s first 16-gigabit (Gb) LPDDR5 mobile DRAM, using extreme ultraviolet (EUV) technology.
CMP Consumables US$2.5B in 2020 for IC Fabs
TECHCET announces that the global market for chemical-mechanical planarization (CMP) consumable materials in semiconductor manufacturing is expected to total over US$2.5 billion this year.
Global Semiconductor Sales Increase 5.1 Percent Year-to-Year in June; Q2 Sales Down Slightly Compared to Q1
The Semiconductor Industry Association (SIA) announced worldwide sales of semiconductors were $34.5 billion in June 2020, an increase of 5.1 percent from the June 2019 total of $32.9 billion.
IBM Reveals Next-Generation IBM POWER10 Processor
IBM today revealed the next generation of its IBM POWER central processing unit (CPU) family: IBM POWER10.
