The technical challenges and advances being realized in modern RF process power systems that make sub 10 nm processing possible are reviewed.
Editor’s Picks
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: Inspection and Metrology
AI and ML have great potential in many areas of the semiconductor manufacturing process, ranging in scale from improving the performance of individual tools to managing an entire fab and optimizing the global supply chain
Novel Virus-Based Colorimetric Sensor Can Show True Colors of Airborne Threats
Scientists employ genetically engineered viruses to produce intuitive color-coded sensors for detecting airborne chemicals.
Wafer Level Packaging Reaches New Heights
Fan-out package revenue is expected to surpass $2B by 2025 and fan-in WLCSP revenue to peak to $3B by 2025 as TSMC continues to drive the fan-out market in 5G applications.
COVID-19 Drives Rise in Global Fab Equipment Spending, SEMI Reports
Soaring pandemic-inspired demand for chips that power everything from communications and IT infrastructures to personal computing, gaming and healthcare electronics will drive an 8% increase in global fab equipment spending in 2020 and a 13% increase in 2021, SEMI announced today in its World Fab Forecast report. Rising demand for semiconductors for datacenter infrastructures and server storage along with the buildup of safety stock as U.S.-China trade tensions intensify are also contributing to this year’s growth.
Unlocking the Secrets of the YMTC 64-Layer 3D Xtacking® NAND Flash
A look inside YMTC’s second-generation 3D-NAND technology, which uses “Xtacking” to bond the peripheral circuitry face-to-face with the memory array instead of alongside.
VLSI Design Optimization and Validation Process Is Like Painting the Forth Bridge
Some EDA tools have introduced an innovative approach that allows designers to generate design metadata one time for certain verification flows.
Understanding Cooling and Particulate Contamination Challenges for Next Generation ALE Technologies
Mixed-refrigerant Joule-Thomson refrigeration can provide the necessary wafer temperatures and cooling power with smaller footprint, better reliability and lower power consumption than alternative cooling technologies. Cryo-trapping can reduce particle generation by removing the water that mediates the particle formation process.
Building Patterns From The Bottom: A Complementary Approach to Lithography
With shrinking dimensions, the classical lithography-based top-down patterning processes are becoming extremely complex and expensive. Therefore, researchers worldwide are investigating alternative processes allowing to build patterns from the bottom. Two promising approaches are directed self-assembly (DSA) and area-selective deposition (ASD).
