While a reduction in production throughput had been an acceptable compromise for smaller structures in previous years, a significant increase in productivity is now back on the agenda of semiconductor manufacturers. HEIDENHAIN encoders with MULTI-DOF TECHNOLOGY unlock these new dimensions of higher accuracy and performance.
MEMS
Inspired by the Human Body, Engineer Designs Chips that Could Make Wearable AI More Energy Efficient
Is it possible to use artificial intelligence tools like ChatGPT without internet access?
xMEMS Introduces 1mm-Thin Active Micro-Cooling “Fan on a Chip”
xMEMS Labs today announced its latest industry-changing innovation: the xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation artificial intelligence (AI) solutions.
NUS and A*STAR Researchers Develop Wearable, Stretchable Sensor
The novel sensor accurately measures markers such as cholesterol and lactate — crucial for the early detection of diseases.
OKI Sets Up New PCB Manufacturing Line for Semiconductor Manufacturing and Testing Equipment at Joetsu Plant
The OKI Group PCB business company OKI Circuit Technology has set up a new ultra-high-multilayer PCB line at the Joetsu Plant in Joetsu City, Niigata Prefecture, with full-scale operations commencing in July.
MetroLED Launches Pixel LED Displays to Expand Growing LED Display Product Line
MetroLED announced the expansion of Pixel LED Displays, a division established in 2010, dedicated to enhancing its successful LED display product line.
New Technique Prints Metal Oxide Thin Film Circuits at Room Temp
Researchers have demonstrated a technique for printing thin metal oxide films at room temperature, and have used the technique to create transparent, flexible circuits that are both robust and able to function at high temperatures.
IMAPS 57th International Symposium on Microelectronics Planned for September 30 – October 3, 2024, in Boston
The 57th International Symposium on Microelectronics (IMAPS 2024) will be held September 30 – October 3, 2024, at the Encore Boston Harbor in Boston, Massachusetts.
Movellus Joins the Silicon Catalyst In-Kind Partner Ecosystem
Movellus today announced that it has joined the Silicon Catalyst ecosystem as the newest member of their In-Kind Partner (IKP) network.
HKUST Engineering Researchers Pave the Way for Advanced Wearable Display Technologies
A research team led by the School of Engineering of the Hong Kong University of Science and Technology (HKUST) has developed full-color fiber light-emitting diodes utilizing perovskite quantum wires (PeQWs), paving the way for innovative wearable lighting and display devices.
