The scia Mill 200 system provides highly precise surface structuring of thin films with enhanced selectivity.
MEMS
Arm Announces Appointment of Young Sohn to its Board of Directors
Arm today announced the appointment of new Board member Young Sohn.
Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave
The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program.
What’s in the August/September Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the August/September issue.
MEMS & Imaging Sensors Summit to Highlight Innovations Driving the Next Generation of Connectivity
The SEMI MEMS & Imaging Sensors Summit, themed Sensor Revolution for a Connected Future, is set to bring together some of the world’s leading minds in sensor technology on November 14 at the International Conference Center Munich (ICM), Germany.
Solving a Memristor Mystery to Develop Efficient, Long-Lasting Memory Devices
Newly discovered role of phase separation can help develop memory devices for energy-efficient AI computing.
xMEMS Micro Speaker Technology Delivers High-Quality Audio to New SOUNDPEATS TWS Earbuds
xMEMS Labs today announced collaboration with SOUNDPEATS to equip its all-new Capsule3 Pro+ TWS earbuds with its Cowell micro speaker.
Boston Semi Equipment Enters Magnetic MEMS Testing Market with Initial Order from Leading Automotive IC Manufacturer
Boston Semi Equipment (BSE) today announced it has received an order from a global manufacturer of sensor integrated circuits (ICs) in the automotive market for its new Zeus handler configuration for magnetic micro-electromechanical systems (MEMS) testing.
Starting a Fluorescent Biosensor Revolution
Molecular biosensors that only light up upon binding their targets open vast possibilities for medical diagnostics, fundamental research, environmental monitoring, and more.
DELO Introduces New Microelectronics Adhesive for Ultra-Fine Structures
DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds.
