The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, today announced the publication of the Skills Strategy report by DECISION Etudes & Conseil that outlines the strategic approaches required to tackle Europe’s growing talent shortage in the semiconductor sector.
MEMS
SIA Commends Selections for CHIPS R&D Flagship Facilities
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities.
Research for the Future, Application Transfer for the Present
Advancements in industry and technology are constantly demanding new solutions for the manufacturing of microchips regarding the technical, economic and also ecological perspective.
US-Manufactured Nanopositioning Stage for Super Resolution Microscopy, Material Science
PI (Physik Instrumente) offers a series of piezo-flexure controlled nanopositioning stages for high-resolution microscopy and material science applications.
Smart Sensor Patch Detects Health Symptoms Through Edge Computing
Edge computing on a smartphone has been used to analyze data collected by a multimodal flexible wearable sensor patch and detect arrhythmia, coughs and falls.
ESCATEC Pushes New Boundaries in Micro-Electronics with UV Enhanced Die Bonder Technology
Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.
Towards Implementing Neural Networks on Edge IoT Devices
Researchers propose a novel magnetic RAM-based architecture that leverages spintronics to realize smaller, more efficient AI-capable circuits.
Critical Manufacturing Brings Highly Advanced Semiconductor MES Solution to SEMICON Europa
Critical Manufacturing is returning to SEMICON Europa 2024 to showcase its advanced Manufacturing Execution System (MES), tailored to the unique needs of the semiconductor industry.
New DUV Micro-LED Array Advances Maskless Photolithography
A team led by Prof. Sun Haiding from the University of Science and Technology of China (USTC) developed a vertically integrated micro-scale light-emitting diode (micro-LED) array, which was then applied in deep ultraviolet (DUV) maskless photolithography system for the first time.
Earthquake on a Chip: Scientists Harness Sound Waves on the Surface of a Microchip
New chip design uses special glass to allow interactions between light and sound.
