MEMS

A*STAR’s Institute of Microelectronics and STMicroelectronics Team Up on Silicon Carbide R&D for the EV Market and Industrial Applications

The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the start of a Research & Development (R&D) collaboration in the field of silicon carbide (SiC) for power-electronics applications in the automotive and industrial markets.

Forza Integrated Production Services Achieve Practical Yields for Back Side Illumination Sensors

Forza Silicon recently used its Integrated Production Services (IPS) to enable the production of high-speed image sensors that employ back side illumination (BSI) technology.

Researchers Use AI to Optimize Several Flow Battery Properties Simultaneously

Scientists seek stable, high-energy batteries designed for the electric grid.

New Device Modulates Visible Light – Without Dimming It – With the Smallest Footprint and Lowest Power Consumption

Over the past several decades, researchers have moved from using electric currents to manipulating light waves in the near-infrared range for telecommunications applications such as high-speed 5G networks, biosensors on a chip, and driverless cars.

SIA Applauds Bicameral Agreement on Path Forward for USICA

Senate-passed legislation includes $52 billion to fund the semiconductor manufacturing, research, and design provisions in the CHIPS for America Act.

Aehr Test Systems Joins PowerAmerica Institute to Support Advancing SiC & GaN Tech for Next-Gen Power Electronics, Electric Vehicles

Aehr Test Systems, a supplier of semiconductor test and reliability qualification equipment, announced today that it has joined the PowerAmerica Institute (PowerAmerica), a public-private research initiative dedicated to accelerating the adoption of high performing, next generation silicon carbide (SiC) and gallium nitride (GaN) power electronics.

UArizona Researchers Develop Ultra-Thin ‘Computer on the Bone’

A team of University of Arizona researchers has developed an ultra-thin wireless device that grows to the surface of bone and could someday help physicians monitor bone health and healing over long periods.

CEA-Leti Unveils Breakthrough for Mass-Market, High-Performance, Navigation-Grade Gyroscopes

CEA-Leti scientists, in collaboration with researchers at Politecnico di Milano have developed the world’s smallest-footprint MEMS gyroscope that is capable of providing navigation-grade performance.

Annual Revenue Growth to Skyrocket Among Top 25

Big gains in artificial intelligence, machine learning, 5G infrastructure provide strong boost to sales growth at AMD, MediaTek, Nvidia, and Qualcomm this year; declines for Intel and Sony.

Common Vulnerability and Exposures (CVE) Program Adds Silicon Labs as CVE Numbering Authority (CNA)

Silicon Labs (NASDAQ: SLAB) today announced it has been added as a Common Vulnerability and Exposures (CVE) Numbering Authority (CNA) by the CVE Program, allowing Silicon Labs to proactively assign identifiers to common vulnerabilities and exposures in accordance with cybersecurity standards.

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