Moov, a data-fueled marketplace for used manufacturing equipment, today announced that Austin, Texas, will be the location of the company’s second headquarters.
MEMS
Scientists Weave Atomically Thin Wires Into Ribbons
Researchers from Tokyo Metropolitan University have succeeded in using nanowires of a transition-metal chalcogenide to make atomically thin “nanoribbons”.
SmartSens Selects PDF Solutions Exensio Fabless for Data Analytics of CMOS Image Sensors
PDF Solutions, Inc. (NASDAQ: PDFS), a global provider of differentiated data and analytics solutions to the semiconductor and electronics industries, today announced that SmartSens, a CMOS image sensor (CIS) semiconductor company, has selected Exensio Fabless as the platform to perform data management and analytics for their entire family of CIS products.
The Real Reason Behind the Automotive Industry IC Shortage — A Step-Function Surge in Demand
After years of moderate increases, IC suppliers blindsided by automotive IC demand spike in 2021.
SRC and NSF to Support Semiconductor Research Experiences for Undergraduates
The U.S. National Science Foundation (NSF) and Semiconductor Research Corporation (SRC) recently signed a memorandum of understanding to support hands-on research opportunities for undergraduate students in technical areas related to semiconductors.
JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version of its High Bandwidth Memory (HBM) DRAM standard.
NucleiSys Adopts Breker’s System Coherency TrekApp
Breker Verification Systems announced Nuclei System Technology deployed its System Coherency Synthesis TrekApp to ensure coherency of its configurable low-power and high-performance 32- and 64-bit RISC-V processor intellectual property (IP) designs.
America COMPETES Act of 2022 Is a Much-Needed Bill, but Not Sufficient to Compete with China, Says ITIF
Following the introduction of the America COMPETES Act of 2022 from the House of Representatives, companion legislation to the U.S. Innovation and Competition Act (USICA), which passed the Senate last June, the Information Technology and Innovation Foundation (ITIF), the leading think tank for science and technology policy, released the following statement.
CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets
CEVA, Inc. announced today that it has expanded its IP market reach by introducing the Fortrix SecureD2D IP solution.
North American Semiconductor Equipment Industry Posts December 2021 Billings
After record-breaking billings of North America-based semiconductor equipment manufacturers in November 2021, December billings remained robust and were the second-highest ever.
