JEDEC Solid State Technology Association announced today that Bill Gervasi, Principal Systems Architect, Nantero, has been presented with the JEDEC Award of Excellence.
MEMS
CES 2022: CEA-Leti to Unveil World’s-First Multi-Sensor System For Knee-Implants That Improves Surgery Accuracy, Detects Infection Early and Enhances Rehabilitation
CEA-Leti, a CEA microelectronics research institute, will introduce a smart, integrated multi-sensor system for knee implants at CES 2022 that can help surgeons more accurately position the implant, dramatically reduce risk of follow-up surgery, and enhance rehabilitation.
Soft Semiconductors that Stretch like Human Skin Can Detect Ultra-Low Light Levels
Flexible electronics breakthrough could enhance biosensor technology, from wearables to soft-robotic implantable systems.
SEMICON Japan 2021 Hybrid Opens Tomorrow In-Person to Highlight Smart Technologies and Electronics Manufacturing Supply Chain Growth Opportunities
SEMICON Japan, the largest and most influential gathering of the electronics manufacturing supply chain in Japan, opens tomorrow at Tokyo Big Sight with a focus on innovation opportunities and business growth potential fueled by leading-edge technologies including 5G, artificial intelligence (AI), deep learning and quantum computing.
Global Total Semiconductor Equipment Sales On Track to Top $100 Billion in 2021 for First Time, SEMI Reports
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach a new high of $103 billion in 2021, surging 44.7% from the previous industry record of $71 billion in 2020, SEMI announced today.
imec Demonstrates Successful Monolithic Integration of Schottky Diodes and Depletion-Mode HEMTs with 200V GaN-IC
This week, at the 2021 International Electron Devices Meeting (IEEE IEDM 2021), imec, the research and innovation center in nanoelectronics and digital technologies, presents the successful co-integration of high-performance Schottky barrier diodes and depletion-mode HEMTs on a p-GaN HEMT-based 200V GaN-on-SOI smart power integrated circuits (ICs) platform developed on 200mm substrates.
IAR Systems Appoints Richard Lind as CEO
Richard Lind has been a board member of I.A.R. Systems Group AB since 2019 and is a former CTO of the Internet of Things (IoT) at Microsoft.
First System on Chip Developed in a Pioneering Project Between Tampere University, Finland, and Companies
The first System on Chip (SoC) developed by the Finnish SoC Hub consortium has been taped out. The project partners will focus next on improving the design, automation and performance of the SoC.
Global Semiconductor Alliance Announces Recipients of its Annual Awards
For over a quarter century, the Global Semiconductor Alliance (GSA) Awards have recognized the achievements of top performing semiconductor companies in several categories ranging from outstanding leadership to financial accomplishments, as well as overall respect within the industry.
STMicroelectronics Drives the Future of EVs and Industrial Applications with New Silicon-Carbide Devices
ST’s latest-generation silicon-carbide (SiC) power devices extend leadership in performance and reliability for e-mobility and energy-efficient industry.
