GlobalFoundries (GF) today announced a portfolio of new features that extend its solutions roadmap and accelerate the next wave of innovation in chip design for smart mobile devices,datacenter, IoT and automotive.
MEMS
TrendForce Announces 10 Tech Industry Trends for 2022
In a recent statement, TrendForce detailed 10 major trends that are expected to take place across various segments in the tech industry.
Pfeiffer Vacuum Presents a Cloud-Based Solution for Service Management
Pfeiffer Vacuum’s new “Virtual Service Management” (VSM) is a free web app that makes it possible to manage vacuum equipment from different manufacturers.
Global Fab Equipment Spending Projected to Reach New High of Nearly $100 Billion in 2022, SEMI Reports
Powered by digital transformation and other secular technology trends, global semiconductor equipment investments for front end fabs in 2022 are expected to reach nearly US$100 billion to meet soaring demand for electronics after topping a projected $90 billion this year, both new records, SEMI highlighted today in its World Fab Forecast report.
MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret
This patent covers an innovative design that utilizes a precision horizontal tool holding turret for rapid and in-process calibration-free tool changing.
Quantum Materials Cut Closer Than Ever
A new method designs nanomaterials with less than 10-nanometer precision. It could pave the way for faster, more energy-efficient electronics.
Tower Semiconductor Announces Breakthrough LiDAR Technology for Advanced Driver-Assistance Systems
Tower Semiconductor, the foundry of high-value analog semiconductor solutions, today announced a breakthrough development of LiDAR IC technology designed for advanced driver-assistance systems (ADAS) and ultimately self-driving cars.
What’s in the August/September Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the August/September issue…
Ultra-efficient Tech to Power Devices of Tomorrow and Forge Sustainable Energy Future
Researchers from The Australian National University (ANU) have developed a system to transport data using atomically-thin semiconductors in a way that is extremely energy-efficient.
Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon
Cadence Design Systems, Inc. today announced that it has collaborated with Samsung Foundry to deliver qualified Mixed-Signal OpenAccess-ready process design kit (PDK) technology files that support a range of Samsung process technologies from 28FDS to GAA base 3nm.
