MEMS

Analog Piezoelectric Voice Accelerometer From Vesper Enables “High Fidelity Voice Pickup” in Small Hearable Devices

Vesper, a global MEMS supplier of the most advanced piezoelectric sensors, today introduced the VA1200, the world’s first analog piezoelectric voice accelerometer (a.k.a. bone conduction sensor).

CEA-Leti Announces EU Project to Mimic Multi-Timescale Processing of Biological Neural Systems

CEA-Leti announced today the launch of an EU project to develop a novel class of algorithms, devices and circuits that reproduce multi-timescale processing of biological neural systems.

Understanding Interfaces of Hybrid Materials with Machine Learning

The production of nanomaterials involves self-assembly processes of functionalized (organic) molecules on inorganic surfaces. This combination of organic and inorganic components is essential for applications in organic electronics and other areas of nanotechnology.

Leveraging the 5G Network to Wirelessly Power IoT Devices

Researchers at the Georgia Institute of Technology have uncovered an innovative way to tap into the over-capacity of 5G networks, turning them into “a wireless power grid” for powering Internet of Things (IoT) devices that today need batteries to operate.

Wearable Sensors that Detect Gas Leaks

Professor Junsuk Rho’s research team at POSTECH develops wearable gas sensors that display instantaneous visual holographic alarm.

Synopsys AI-Driven Design System Enables Renesas to Achieve Breakthrough in Productivity

Synopsys, Inc. today announced the adoption of DSO.ai (Design Space Optimization AI), Synopsys’ award-winning autonomous artificial intelligence (AI) design system, by Renesas into its advanced automotive chip design environment.

Stretching the Boundaries of Medical Tech with Wearable Antennae

Researchers from Penn State led two international collaborations to prototype a wireless, wearable transmitter while also improving the transmitter design process.

Photonic MEMS Switches Going Commercial

Switch that uses existing fabrication method a step toward integration in data communication networks.

Digital Isolator from STMicroelectronics Boosts Performance and Reliability Using New Thick-Oxide Galvanic Isolation Technology

STMicroelectronics has begun volume production of the STISO621 dual-channel digital isolator, launching a new series of high-performance ICs for industrial applications and general optocoupler replacement.

STMicroelectronics Introduces New MasterGaN4 Devices for High-Efficiency Power Conversion up to 200 Watts

The latest addition to ST’s MasterGaN family, MasterGaN4 simplifies design using wide-bandgap GaN power semiconductors by taking away the complex gate-control and circuit-layout challenges.

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