The Semiconductor Industry Association (SIA) today welcomed the release of a White House report on strengthening the supply chains of critical products, including semiconductors.
MEMS
Bosch Opens Wafer Fab of the Future in Dresden
Fully connected, data-driven, self-optimizing: in Dresden, Bosch is opening one of the world’s most modern wafer fabs.
IEEE International Electron Devices Meeting Announces 2021 Call for Papers
Under the theme “Devices for a New Era of Electronics: From 2D Materials to 3D Architectures,” the 67th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
Dominant Factor of Carrier Transport Mechanism in Multilayer Graphene Nanoribbons Revealed
Researchers precisely set the number of layers in multilayer graphene nanoribbons, controlling the semiconducting and metallic properties of field effect transistors and establishing a design guideline for the practical applications of graphene devices.
CEA-Leti Launches Direct Analysis to Bring Speed and Efficiency to Food-Safety Testing
Armed with exclusive access to 11 CEA-Leti patents covering specialties such as DNA extraction and microscopic-sample diagnostics, CEA-Leti startup Direct Analysis has developed a pathogenic-bacteria-detection system for food manufacturers that takes one-fourth of the time of existing tests, can minimize stoppage of production lines and reduce food-product recalls and losses.
Smaller Companies Fuel Growth in Worldwide Wearables Market in 1Q21, Says IDC
The appetite for wearable devices remained strong in the first quarter of 2021 (1Q21) even as volumes retreated from record fourth quarter levels.
CEA-Leti Introduces Plastic mmWave System for Applications Requiring Ultra-Low Latency and Ultra-High-Speed Connectivity
As part of its broad focus on millimeter-wave (mmWave) data transfer applications, CEA-Leti has developed a hybrid, ultra-fast, ultra-low latency technology that guides mmWave radio signals through flexible plastic tubing.
OmniVision Announces 0.61µm pixel, High Resolution 4K Image Sensor
OmniVision Technologies, Inc., a developer of advanced digital imaging solutions, today announced the OV60A―the world’s first 0.61 micron (µm) pixel high resolution CMOS image sensor that will revolutionize the capabilities of next-generation mobile phone cameras.
Global Organic CMOS Image Sensor Market is Expected to Grow at a CAGR of 12.2% from 2017 to 2028
The global Organic CMOS Image Sensor Market was valued at USD 1,086.7 million in 2020 and is projected to register a CAGR of 12.2% to reach USD 2,723.8 million by 2028 in the COVID-19 period.
Winbond and Ambiq Collaborate on Ultra-Low Power, Intelligent IoT, and Wearables
Winbond Electronics Corporation and Ambiq announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low power system solutions for IoT endpoints and wearables.
