Xanadu, a full-stack photonic quantum computing company and imec, a research and innovation center in nanoelectronics and digital technologies, have today announced a partnership to develop the next generation of photonic qubits based on ultra-low loss silicon nitride (SiN) waveguides.
MEMS
A Holistic Approach to Materials for the Next Generation of Electrical Insulation
Researchers from The University of Texas at Austin in collaboration with the U.S. Army Research Lab are analyzing new materials for electrical insulation, or packaging, that can remove heat more effectively compared to today’s insulation, amid a need to redesign our electrical infrastructure for the next 100 years and beyond to match advanced technology.
IAR Systems Collaborates with NSITEXE
IAR Systems, the future-proof supplier of software tools and services for embedded development, today announced its partnership with NSITEXE.
Amtech Appoints New Member to Board of Directors
Amtech Systems, Inc. today announced the appointment of Robert C. Daigle to its Board of Directors.
Samsung Introduces the Industry’s First 5nm Processor Powering the Next Generation of Wearables
Samsung Electronics Co., Ltd. today announced its new wearable processor, the Exynos W920.
Macronix and Foxconn Sign Asset Transaction Agreement for 6-inch Wafer Fab
Macronix International Co., Ltd. and Hon Hai Technology Group today announced the signing of an Asset Transaction Agreement for the sales of Macronix’s 6-inch wafer fab and equipment in Hsinchu Science Park to Foxconn for NT$2.52 billion.
SEMI Unveils Diversity, Equity and Inclusion Roadmap, Toolkit and Event Guidelines
SEMI, the trade association representing the global electronics design and manufacturing supply chain, today unveiled a Diversity, Equity and Inclusion Roadmap and Toolkit to help its more than 2,400 members transform the way they hire and retain employees and build a more diverse workforce.
“Fabrica 2.0 Machine” Replaces the “Tera 250” Name, Following the Latest Acquisition by Nano Dimension
Nano Dimension Ltd. announced today that Nanofabrica Ltd. and its 3D additively manufacturing (AM) printing system have been officially renamed following the acquisition by Nano Dimension in April 2021.
New Printing Technique for Flexible Electronics
Researchers from the Daegu Gyeongbuk Institute of Science and Technology have developed a faster and more reliable way to print flexible digital devices.
SIA Calls for House Passage of Bipartisan Research Bills
SIA CEO John Neuffer urges House to approve this legislation and calls on Congress to include robust funding for domestic chip production, innovation as these bills advance.
