Winbond Electronics Corporation and Ambiq announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low power system solutions for IoT endpoints and wearables.
MEMS
CEA-Leti Unveils World’s First Autonomous Imager For Smartphones, Smart-Home Appliances and Automobiles
CEA-Leti today announced the world’s first autonomous imager technology that activates smartphones and small appliances through face recognition or other specific patterns.
Implantable Piezoelectric Polymer Improves Controlled Release of Drugs
Repeated tests showed a similar amount of drug release per activation, confirming robust control of release rate.
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the April/May issue…
Robust Federal Incentives for Domestic Chip Manufacturing Would Create an Average of Nearly 200,000 American Jobs Annually as Fabs are Built
Semiconductor industry currently employs 277,000 people in the U.S. across 49 states, supports 1.6 million additional U.S. jobs, according to Oxford Economics/SIA study.
New Method of Seeing Graphene Growing Using a Standard Electron Microscope
Researchers from the University of Surrey have revealed a new method that enables common laboratory scanning electron microscopes to see graphene growing over a microchip surface in real time.
Think Silicon and Ambiq Enable Ultra-Low Power IoT Devices with Smartphone-Class, 3D-Like Graphics
Think Silicon S.A. and Ambiq today announced the companies are working together to bring high-end graphics capabilities to designers of everyday wearable devices.
STMicroelectronics Acquires Edge AI Software Specialist Cartesiam
STMicroelectronics today announced a transaction with Cartesiam to acquire its assets (including its IP portfolio)…
STMicroelectronics Honored with Prestigious IEEE Milestone for Historical “Multiple Silicon Technologies on a Chip” Achievement
STMicroelectronics today announced that the Institute of Electrical and Electronics Engineering (IEEE) presented the Company with an IEEE Milestone for its groundbreaking work in the super-integrated silicon-gate semiconductor process technology.
Allegro’s New 3DMAG Magnetic Position Sensor Enables Next-Generation ADAS Applications
Allegro MicroSystems, Inc. today announced the release of the A31315 sensor, the newest member of the 3DMAG family of rotary and linear magnetic position sensor ICs for automotive and industrial applications.
