The HFDA801A from STMicroelectronics is a high-resolution audio amplifier that is specifically designed for compact, cost-effective automotive applications.
MEMS
Precision, High-Voltage Bi-directional Current-Sense Amplifiers from STMicroelectronics Boost Robustness and Power Efficiency
STMicroelectronics has introduced three precision high-voltage bi-directional current-sense amplifiers that provide the extra convenience of a Shutdown pin to maximize energy savings.
SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for HPC Applications
SiPearl, the company designing the high-performance, energy-efficient microprocessor for the European exascale supercomputer and Open-Silicon Research, the India based entity of OpenFive, a leading provider of custom silicon solutions with differentiated IP, today announced a multi-year joint collaboration to enable expansive development of innovative High Performance Computing (HPC) applications.
Sony Announces Launch of New Low Power Cellular IoT Chipset for NB-IoT Networks – ALT1255
Sony Semiconductor Israel (Sony), a leading provider of cellular IoT chipsets, announced the launch of the Altair ALT1255, a new low-power NB2 chipset. The ALT1255 is 5G ready, designed with an integrated SIM (iSIM), user MCU, rich application layer, and GSM/GPRS fallback modem.
Fujitsu and University of Toronto Researchers Develop Quantum-Inspired Technology to Optimize Radiation Treatment Plans for Brain Tumors and Other Diseases
Fujitsu Laboratories, Ltd. in collaboration with researchers at the University of Toronto (U of T) today announced the development of a technology for dramatically streamlining the creation of radiation treatment plans for Gamma Knife(1) radiosurgery, leveraging Fujitsu’s quantum-inspired computing technology, the Digital Annealer, which rapidly solves combinatorial optimization problems.
Virtual MSTC 2021 to Showcase Next Wave of Sensorization for Driving Medical and Mobility Advances
Leading-edge MEMS and sensors advances for driving the next generation of medical and mobility applications will take center stage at the SEMI MEMS and Sensors Technical Congress (MSTC 2021), April 13-15, as industry visionaries and experts gather to discuss the latest trends and innovations in sensorization. Themed the Next Wave of Sensorization for Solving Our Shared Challenges, the virtual event will feature keynotes, panels, technical sessions, career booths and networking…
SEMI Applauds President Biden, Bipartisan Congressional Leaders for Supporting Semiconductor Supply Chain Incentives
SEMI today released the following statement from president and CEO Ajit Manocha on the support of funding incentives to expand U.S. semiconductor manufacturing and research by President Biden and a bipartisan group of members of Congress in a meeting at the White House on February 24, 2021.
Qurv and Infineon Win for Leading MEMS and Image Sensors Innovations at SEMI Technology Showcase
Qurv and Infineon Technologies have won the MEMS & Imaging Sensors Technology Showcase at the Technology Unites Global Summit, SEMI announced this week.
CEVA Appoints Jaclyn Liu to its Board of Directors; Bruce A. Mann Retires
CEVA, Inc., the licensor of wireless connectivity and smart sensing technologies, today announced that Jaclyn “Jackie” Liu has been appointed to its Board of Directors, as an independent member, effective February 16, 2021.
Broad Coalition of Tech, Medical, Auto, Other Business Leaders Urge President Biden to Fund Domestic Semiconductor Manufacturing, Research in Infrastructure Plan
The Semiconductor Industry Association (SIA), along with a broad coalition of 16 other tech, medical, auto, and other business groups, today in a letter urged President Biden to work with Congress to fully fund domestic semiconductor manufacturing and research provisions established in the recently enacted National Defense Authorization Act (NDAA).
