Okmetic, the supplier of advanced silicon wafers for the manufacture of microelectromechanical systems and sensors, today announced the release of UF-RFSi, a tailored silicon substrate dedicated for thin film surface acoustic wave (TF-SAW) hybrid structures.
MEMS
Deciphering the Secrets of Printed Electronics
We live in a world where we want our electronics to be flexible, bendable and stretchable apart from being intelligent. Printed electronics technology has emerged as the main route to enable this vision.
STMicroelectronics and OQmented to Jointly Develop, Manufacture, and Market Advanced MEMS Mirror-Based Laser-Beam Scanning Solutions
The joint effort aims to build on the expertise of both companies to advance the technology and products behind the leading MEMS-mirror-based laser-beam scanning (LBS) solutions in the market.
Samsung and Marvell Unveil New System-on-a-Chip to Advance 5G Networks
Samsung Electronics Co., Ltd. and Marvell today announced that the companies jointly developed a new System-on-a-Chip (SoC) to enhance 5G network performance.
Mobile Phone Accessories Demand Is Surging; Protective Cases & Covers Will Account for Nearly 20% Sales: New Study
The increasing application of mobile phones and the expansion of 5G technology to ease operations and help in the smoother functioning of these devices are expected to have significant impact on mobile phone accessories market.
High-Accuracy Op Amp from STMicroelectronics Targets Energy-Efficient Power Conversion
The STMicroelectronics TSV7722 precision high-bandwidth operational amplifier, with gain-bandwidth of 22MHz and slew rate of 11V/μs, is well-suited for high-speed signal conditioning and accurate current measurement in power-conversion circuits and optical sensors.
CHIPS Alliance and RISC-V International Invite the RISC-V Community to Participate in Updating a New Unified Memory Architecture Standard
New joint working group will enhance the OmniXtend Cache Coherency architecture.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the March issue…
Micron Achieves Comprehensive Global Pay Equity for All Underrepresented Groups
Micron Technology, Inc. today announced that it has reached comprehensive global pay equity in total employee compensation across base, bonuses and stock rewards.
SEMICON Southeast Asia Rescheduled to 23-27 August 2021 as Hybrid Event
SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced the rescheduling of SEMICON Southeast Asia (SEA) to 23-27 August 2021 as a hybrid event to ensure the safety of exhibitors, partners and guests as the world continues to combat the COVID-19 pandemic and the rollout of vaccines progresses.
