CEVA, Inc., the licensor of wireless connectivity and smart sensing technologies, today announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs.
MEMS
Long Live the Efficient, Pure-Blue OLED
Using a new combination of emitter molecules, researchers in Japan have demonstrated the promise of a novel approach to finally overcome a major challenge facing displays using organic light-emitting diodes: a blue light source matching the excellent performance of the red and green ones.
IBM Selected for Department of Defense Award to Support Advancing the United States Microelectronics Technology Design Capabilities
IBM today announced a Phase 1 Other Transactions Agreement under the Rapid Assured Microelectronics Prototypes (RAMP) Advanced Commercial Capabilities Project through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Agreement (OTA) to support advancing U.S. microelectronics technology.
Semiconductor Industry Applauds NDAA Enactment, Urges Full Funding for Semiconductor Manufacturing and Research Provisions
The Semiconductor Industry Association (SIA) today applauded Congress for enacting the National Defense Authorization Act (NDAA), legislation that includes Title XCIX, “Creating Helpful Incentives to Produce Semiconductors for America,” which authorizes federal incentives to promote semiconductor manufacturing and federal investments in semiconductor research.
What to Expect from the IC Industry in 2021
The year 2020 was a most unusual and challenging year for businesses and consumers.
New Electron Microscopy Technique Offers First Look at Previously Hidden Processes
Northwestern researchers have developed a new microscopy method that allows scientists to see the building blocks of “smart” materials being formed at the nanoscale.
IBM Selected for Department of Defense Award to Support Advancing the United States Microelectronics Technology Design Capabilities
IBM today announced a Phase 1 Other Transactions Agreement under the Rapid Assured Microelectronics Prototypes (RAMP) Advanced Commercial Capabilities Project through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Agreement (OTA) to support advancing U.S. microelectronics technology.
Cobham Advanced Electronic Solutions Receives $48M Contract for Medical Imaging Electronics
Cobham Advanced Electronic Solutions (CAES) recently received a $48M contract to support the medical imaging industry, providing Application Specific Integrated Circuits (ASICs) and product support.
Two UArizona Researchers Receive $1M Grants to Advance Cyberinfrastructure and Quantum Sensing
Laura Condon, a University of Arizona assistant professor of hydrology and atmospheric sciences, and Zheshen Zhang, assistant professor of materials science and engineering and optical sciences, have each received $1 million in funding from the National Science Foundation’s Convergence Accelerator program.
Low-Power Radar Chip Enables Devices to Sense Vital Signs
A radar sensor operating at 60 GHz can detect small motions with high range resolution. Thanks to chip technology and a phenomenal reduction in power consumption, these radar sensors are becoming ready for the next big step: integration into tiny, battery-powered devices. This enables a range of smart health applications, from contactless heartbeat sensors to non-invasive fall detection systems.
