SEMI today released the following statement from president and CEO Ajit Manocha on the support of funding incentives to expand U.S. semiconductor manufacturing and research by President Biden and a bipartisan group of members of Congress in a meeting at the White House on February 24, 2021.
MEMS
Qurv and Infineon Win for Leading MEMS and Image Sensors Innovations at SEMI Technology Showcase
Qurv and Infineon Technologies have won the MEMS & Imaging Sensors Technology Showcase at the Technology Unites Global Summit, SEMI announced this week.
CEVA Appoints Jaclyn Liu to its Board of Directors; Bruce A. Mann Retires
CEVA, Inc., the licensor of wireless connectivity and smart sensing technologies, today announced that Jaclyn “Jackie” Liu has been appointed to its Board of Directors, as an independent member, effective February 16, 2021.
Broad Coalition of Tech, Medical, Auto, Other Business Leaders Urge President Biden to Fund Domestic Semiconductor Manufacturing, Research in Infrastructure Plan
The Semiconductor Industry Association (SIA), along with a broad coalition of 16 other tech, medical, auto, and other business groups, today in a letter urged President Biden to work with Congress to fully fund domestic semiconductor manufacturing and research provisions established in the recently enacted National Defense Authorization Act (NDAA).
Nanotechnologies Reduce Friction and Improve Durability Of Materials
Scientists suggested using nanotechnologies to reduce friction and improve durability of materials.
Samsung Develops Industry’s First High Bandwidth Memory with AI Processing Power
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry’s first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power — the HBM-PIM.
SEMI Technology Unites Global Summit Opens with Executive Forum, Digital Transformation, Security and Sustainability in Spotlight
SEMI Technology Unites Global Summit opens today with keynotes on the power of technology to unite the world and insights on how the microelectronics industry can enable a secure and sustainable digital future.
U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York
GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, today announced a strategic partnership with the U.S. Department of Defense (DoD) to provide a secure and reliable supply of semiconductor solutions manufactured at GF’s Fab 8 in Malta, New York.
STMicroelectronics Eases Design of USB Type-C Power Adapters with Highly Efficient Power Delivery and PPS Reference Design
STMicroelectronics has revealed a USB Type-C Power Delivery 3.0 reference design with Programmable Power Supply (PPS) support to accelerate the design of easy-to-use, compact, and efficient power adapters up to 27W with zero-power operation when no cable is connected.
Sensata Technologies Signs Definitive Agreement to Acquire Xirgo Technologies
Sensata Technologies (NYSE: ST), a leading industrial technology company and provider of sensor-rich solutions that create insight for customers, today announced the acquisition of leading telematics and data insight provider, Xirgo Technologies Intermediate Holdings, LLC (“Xirgo”) for $400 million, or approximately 16.0x 2021 EBITDA. Xirgo’s annual revenue is expected to exceed $100 million in 2021 with projected revenue growth in excess of 20% over the next several years. The transaction…
