MEMS

Sequans Opens New R&D Facility in Finland

Sequans Communications S.A. (NYSE: SQNS), leading developer and provider of 5G and 4G solutions for broadband, critical, and massive IoT, announced that it has established a new subsidiary in Salo, Finland, the purpose of which is to support Sequans core development work on 5G and 4G IoT semiconductor solutions. “We established this new R&D center in order to take advantage of the talented community of wireless engineers in Finland who…

Biosensors Monitor Plant Well-Being in Real Time

Researchers at Linköping University, Sweden, have developed biosensors that make it possible to monitor sugar levels in real time deep in the plant tissues – something that has previously been impossible. The information from the sensors may help agriculture to adapt production as the world faces climate change. The results have been published in the scientific journal iScience. The primary source of nutrition for most of the Earth’s population is…

TES America Completes Acquisition and Relaunches Iconic MicroTouch Brand

TES America LLC, a pioneer in the touch solutions market, announced today it has finalized the acquisition of certain assets from 3M Touch Systems, a subsidiary of  3M Company. Along with the purchase, TES acquired the iconic MicroTouch brand of touch monitors and is relaunching the company today, bringing back a cultural icon that created the world’s leading touchscreen technology nearly 40 years ago. TES has outfitted MicroTouch with an…

Complete Energy-Meter Evaluation Board from STMicroelectronics Combines Low-Cost Sensors and Robust Galvanic Isolation

A new evaluation board from STMicroelectronics speeds design of 3-phase AC Watt meters that meet the most stringent international quality and accuracy standards using low-cost, electromagnetic-immune shunt sensors and advanced galvanic-isolation technology for superior reliability and robustness. The EVALSTPM-3PHISO evaluation board combines the high-accuracy STPMS2 metering front-end IC and the advanced STISO621 digital isolator, with customizable turn-key firmware running on an STM32 microcontroller to compute metrology and power-quality data. The…

Wafer-Scale Production of Graphene-Based Photonic Devices

Our world needs reliable telecommunications more than ever before. However, classic devices have limitations in terms of size and cost and, especially, power consumption – which is directly related to greenhouse emissions. Graphene could change this and transform the future of broadband. Now, Graphene Flagship researchers have devised a wafer-scale fabrication technology that, thanks to predetermined graphene single-crystal templates, allows for integration into silicon wafers, enabling automation and paving the…

CHIPS Alliance Brings on Rob Mains as New Executive Director

CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors and systems, today announced the appointment of Rob Mains as the organization’s new executive director. Rob has over 35 years of experience in software engineering and development, with 25 years of experience as an EDA software architect focused on microprocessor design and advanced process node technologies. He most recently served as a technology advisor at Spillbox, and…

CEA-Leti Team Paves the Way for Massive Integration of Qubits, Critical for Achieving Quantum Supremacy

CEA-Leti scientists have opened a pathway to large-scale integration of Si-spin qubits using existing flip-chip processes with die-to-wafer 3D-interconnect technologies developed in-house.

CEA-Leti Announces EU Project to Create Dynamically Programmable Wireless 6G Environments

CEA-Leti today announced a visionary EU 6G research project for next-generation wireless connectivity. Called RISE-6G, it will design, prototype and test smart and energy-sustainable technological advances based on reconfigurable intelligent surfaces (RIS) that will enable programmable control and shaping of the wireless propagation environment.

CyberOptics to Showcase High-Precision Inspection and Metrology Solutions at SEMI Technology Unites Global Summit

CyberOptics Corporation will feature the WX3000 metrology and inspection system with Multi-Reflection Suppression™ (MRS) sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the Virtual SEMI Technology Unites Global Summit from February 15-19th.

Synopsys Demonstrates Silicon Proof of DesignWare 112G Ethernet PHY IP in 5nm Process for High-Performance Computing SoCs

Synopsys, Inc. today announced the silicon proof of DesignWare 112G Ethernet PHY IP in 5nm FinFET process, delivering significant performance, power and area advantages.

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