A new evaluation board from STMicroelectronics speeds design of 3-phase AC Watt meters that meet the most stringent international quality and accuracy standards using low-cost, electromagnetic-immune shunt sensors and advanced galvanic-isolation technology for superior reliability and robustness. The EVALSTPM-3PHISO evaluation board combines the high-accuracy STPMS2 metering front-end IC and the advanced STISO621 digital isolator, with customizable turn-key firmware running on an STM32 microcontroller to compute metrology and power-quality data. The…
MEMS
Wafer-Scale Production of Graphene-Based Photonic Devices
Our world needs reliable telecommunications more than ever before. However, classic devices have limitations in terms of size and cost and, especially, power consumption – which is directly related to greenhouse emissions. Graphene could change this and transform the future of broadband. Now, Graphene Flagship researchers have devised a wafer-scale fabrication technology that, thanks to predetermined graphene single-crystal templates, allows for integration into silicon wafers, enabling automation and paving the…
CHIPS Alliance Brings on Rob Mains as New Executive Director
CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors and systems, today announced the appointment of Rob Mains as the organization’s new executive director. Rob has over 35 years of experience in software engineering and development, with 25 years of experience as an EDA software architect focused on microprocessor design and advanced process node technologies. He most recently served as a technology advisor at Spillbox, and…
CEA-Leti Team Paves the Way for Massive Integration of Qubits, Critical for Achieving Quantum Supremacy
CEA-Leti scientists have opened a pathway to large-scale integration of Si-spin qubits using existing flip-chip processes with die-to-wafer 3D-interconnect technologies developed in-house.
CEA-Leti Announces EU Project to Create Dynamically Programmable Wireless 6G Environments
CEA-Leti today announced a visionary EU 6G research project for next-generation wireless connectivity. Called RISE-6G, it will design, prototype and test smart and energy-sustainable technological advances based on reconfigurable intelligent surfaces (RIS) that will enable programmable control and shaping of the wireless propagation environment.
CyberOptics to Showcase High-Precision Inspection and Metrology Solutions at SEMI Technology Unites Global Summit
CyberOptics Corporation will feature the WX3000 metrology and inspection system with Multi-Reflection Suppression™ (MRS) sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the Virtual SEMI Technology Unites Global Summit from February 15-19th.
Synopsys Demonstrates Silicon Proof of DesignWare 112G Ethernet PHY IP in 5nm Process for High-Performance Computing SoCs
Synopsys, Inc. today announced the silicon proof of DesignWare 112G Ethernet PHY IP in 5nm FinFET process, delivering significant performance, power and area advantages.
Top-10 IC Growth Categories Target Emerging Applications in 2021
IC Insights recently released its 2021 edition of The McClean Report. The new analysis and forecast of the IC industry includes IC Insights’ ranking of IC categories based on sales growth rate.
Global Capacitive Sensor Market to Reach US$ 41.3 Billion by 2027
The global capacitive sensor market was valued at US$ 28.6 Billion in 2019 and is expected to surpass US$ 41.3 Billion by 2027, registering a CAGR of 4.3% during the forecast period (2019-2027), as highlighted in a report published by Coherent Market Insights.
STMicroelectronics Joins ZETA Alliance to Promote Emerging Long-Range IoT Connectivity Standard
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has joined the ZETA Alliance, the industry body promoting ZETA Low-Power Wide Area Network (LPWAN) technology for low-cost long-range IoT connectivity.
