A radar sensor operating at 60 GHz can detect small motions with high range resolution. Thanks to chip technology and a phenomenal reduction in power consumption, these radar sensors are becoming ready for the next big step: integration into tiny, battery-powered devices. This enables a range of smart health applications, from contactless heartbeat sensors to non-invasive fall detection systems.
MEMS
Semtech and AWS Collaborate on AWS IoT Core for LoRaWAN
Semtech Corporation announced that they have teamed up with Amazon Web Services (AWS) to integrate the LoRaWAN protocol on the Network Server with AWS IoT Core, AWS’s managed Cloud service that lets connected devices easily and securely interact with Cloud applications and other devices.
France Awards Soitec-led European Consortium for Semiconductor Innovation
The French Government has granted the REFERENCE consortium led by Soitec, a world leader in semiconductor materials based in France, the “Étoile de l’Europe” (“Star of Europe”) award for innovation in telecommunication.
Aspinity Releases Analog Voice-First Evaluation Kit for Battery-Operated Devices
Aspinity, a pioneer in ultra-low-power analog machine learning processors, launched its Voice-First Evaluation Kit (EVK2), a complete hardware/software development kit that demonstrates Aspinity’s ultra-low-power edge processing solution for analog voice activity detection and preroll.
CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM
CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks.
Partially Hindered by the Pandemic, the MEMS Industry Could Emerge Stronger
Expect mixed effects in the 2020 MEMS market, followed by growth in the longer term.
CEA Combines 3D Integration Technologies & Many-Core Architectures to Enable High-Performance Processors That Will Power Exascale Computing
In an invited paper at IEDM 2020, CEA-List and CEA-Leti, research institutes at CEA, presented their technologies for achieving exascale-level, high- performance computing (HPC). Highlighting CEA-Leti’s state-of-the-art, 3D-technology toolbox and CEA-List’s advanced demonstrators that together enable higher bandwidth and heterogeneity for processors, the paper explains architectural and performance advances and describes how 3D-integration technologies allow heterogeneity and increased bandwidth that are critical for hardware innovations that help enable exascale computing. …
Industry Strategy Symposium to Lead Microelectronics Into New Era of Innovation
SEMI announced today that the virtual Industry Strategy Symposium (ISS) 2021 will take place January 12-13 with the theme Bridging the Gap Between the Physical and Digital Worlds.
CEA-Leti Papers at IEDM 2020 Highlight Progress in Overcoming Challenges to Making GaN Energy-Saving, Power-Electronics Devices
Two complementary research papers from CEA-Leti confirmed that the institute’s approach to gallium-nitride (GaN) technologies is on track overcome challenges in the architecture and performance of advanced GaN devices embedding a MOS gate, and targeting the fast-growing global market for power-conversion systems.
SiTime Continues Leadership in MEMS Timing Market with 2 Billion Units Shipped
SiTime Corporation today announced that it has cumulatively shipped 2 billion units of its silicon MEMS timing solutions.
