MEMS

Rogue Valley Microdevices to Receive CHIPS Act Funds to Support the Construction of New Foundry

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Rogue Valley Microdevices (RVM) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $6.7 million in proposed direct funding under the CHIPS and Science Act.

Keysight Streamlines and Automates Samsung Semiconductor India Research’s 5G Field-to-Lab Workflow

Keysight Technologies, Inc. announces that Samsung Semiconductor India Research (SSIR) has selected the Keysight Signaling Field-To-Lab (S-FTL) solution to streamline and automate its 5G field-to-lab workflow in its Bengaluru lab.

Primarius NanoSpice Simulator Certified for Samsung Foundry 3nm/4nm Process Technology

Primarius Technologies today announced that its NanoSpice universal parallel SPICE simulator has been validated and certified for Samsung Foundry’s 3/4nm technology

NY CREATES and CEA-Leti Announce Strategic Research Partnership

NY CREATES and CEA-Leti today announced their strategic partnership that will initially focus on the research and co-development of magnetic memory devices, which are used to store computer data.

Advanced Energy’s New Impedance Matching Network Provides Ultra-Fast, RF-Synchronized Tuning to Multilevel Pulse States

Advanced Energy Industries, Inc. has unveiled the NavX impedance matching network with algorithms and direct generator communication, enabling superior levels of precise and repeatable plasma control, critical in ‘Angstrom-Era’ fabrication.

CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative

CEA-Leti announced the kick-off meeting today of the FAMES Pilot Line, a pioneering project aimed at advancing semiconductor technologies in Europe.

Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions

Baya Systems and Blue Cheetah Analog Design today announced the availability of a combined chiplet-optimized Network on Chip (NoC) and Physical Layer (PHY) interconnect IP solution.

Pearson’s Connections Academy, SEMI Partnership Will Connect Students and Educators to the Semiconductor Industry

Pearson and its Connections Academy, the fully online public school program serving K-12 students, announced today a strategic partnership with the SEMI Foundation, the 501(c)(3) arm of SEMI, a global industry association representing the electronics manufacturing, semiconductor, and design supply chain market.

CEA-Leti Scientists Detail Progress on 3D Integration Technologies and Promising Approaches for More Than Moore and RF Integrated Systems at VLSI

CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits detailing the institute’s progress on 3D integration technologies, which are a promising approach for designing More than Moore systems, especially radio frequency (RF) integrated systems.

BAE Systems and GlobalFoundries Collaborate to Strengthen Supply of Essential Semiconductors for National Security Programs

Collaboration to focus on U.S. chip manufacturing and joint research and development for advanced chip technologies.

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