MEMS

Micron Introduces World’s Fastest, Most Energy Efficient 60TB SSD

Micron Technology, Inc. today announced it has begun qualification of the 6550 ION NVMe SSD with customers.

SEMICON Europa 2024 Opens Tomorrow to Highlight Innovation and Collaboration Powering Sustainable Growth

SEMICON Europa 2024 opens tomorrow at Messe München in Munich, Germany, convening industry leaders from across the electronics design and manufacturing supply chain to exchange insights on the advancements and trends driving sustainable growth in the semiconductor sector.

Solution to a Decade-Old Problem Will Free Up Quantum Computing Power

University of Sydney quantum researchers Dominic Williamson and Nouédyn Baspin have revealed a transformative new architecture for managing errors that emerge in the operation of quantum computers.

Atomically Thin Memory Resistors Will Optimize Semiconductors for Neuromorphic Computing

A joint project between University of Kansas and University of Houston supported by $1.8 million from the National Science Foundation’s second Future of Semiconductor program (FuSe2) will produce atomically tunable memory resistors.

Fabrication of 4-inch Wafer-Scale Heterostructure via PECVD

KIMM achieves world’s first large-area semiconductor fabrication with TMDc and graphene heterostructure.

European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost Competitiveness of Semiconductor Ecosystem

The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, today announced the publication of the Skills Strategy report by DECISION Etudes & Conseil that outlines the strategic approaches required to tackle Europe’s growing talent shortage in the semiconductor sector.

SIA Commends Selections for CHIPS R&D Flagship Facilities

The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities.

Research for the Future, Application Transfer for the Present

Advancements in industry and technology are constantly demanding new solutions for the manufacturing of microchips regarding the technical, economic and also ecological perspective.

US-Manufactured Nanopositioning Stage for Super Resolution Microscopy, Material Science

PI (Physik Instrumente) offers a series of piezo-flexure controlled nanopositioning stages for high-resolution microscopy and material science applications.

Smart Sensor Patch Detects Health Symptoms Through Edge Computing

Edge computing on a smartphone has been used to analyze data collected by a multimodal flexible wearable sensor patch and detect arrhythmia, coughs and falls.

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