TDK Corporation (TSE:6762) announced that InvenSense Inc., a TDK Group Company, and Arrow Electronics, Inc. have extended their global distribution agreement to supply InvenSense products.
MEMS
Taiwan Prepared for the Post-Covid-19 Era With Emerging Technologies
The Covid-19 pandemic spurs transformation of digital healthcare everywhere. To echo that trend, the Healthcare+ Expo Taiwan will bring together 300 technology giants and healthcare providers to exhibit healthcare-centred applications and solutions powered by AI, IoT, bio-sensor, 8K image tech and 5G to then ignite fresh ideas amongst those with desires to reinvent the way healthcare used to be delivered.
The Smallest Motor in the World
The smallest motor in the world – consisting of just 16 atoms: this was developed by a team of researchers from Empa and EPFL. “This brings us close to the ultimate size limit for molecular motors,” explains Oliver Gröning, head of the Functional Surfaces Research Group at Empa.
CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process
CEA-Leti has demonstrated fabrication of a new gate-all-around (GAA) nanosheet device as an alternative to FinFET technology targeting high-performance (HPC) applications such as smartphones, laptops, and mobile systems with data collection and processing involving low-power and high-speed operation.
GaN Systems Announces Sixth Annual “GaN Systems Cup” China Power Supply Society Design Competition
GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, is proudly sponsoring the distinguished China Power Supply Society (CPSS) design competition, which focuses on innovation in energy conservation, emission reduction, and new energy utilization.
Minimizing Thermal Conductivity of Crystalline Material with Optimal Nanostructure
Towards application of materials informatics to development of thermal functional materials.
Gartner Forecasts Worldwide Device Shipments to Decline 14% in 2020 Due to Coronavirus Impact
Global shipments of devices (PCs, tablets and mobile phones) are on pace to decline 13.6% in 2020, totaling 1.9 billion units, according to the latest forecast from Gartner, Inc.
Moortec Launches New In-Chip Technology for Highly Distributed, Real-Time Thermal Analysis on TSMC N5 Process
Moortec today announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology.
Flexible and Recyclable Optoelectronics Move a Step Closer
Australian researchers have demonstrated the strong potential for a new type of flexible, recyclable electrodes to be used in creating cheaper solar cells, touchscreens, wearable ‘e-skins’ and next-generation responsive windows.
CEA-Leti Researchers Break Throughput Record for LiFi Communications Using Single GaN Blue Micro-Light-Emitting Diode
CEA-Leti today announced its researchers have broken the throughput world record of 5.1 Gbps in visible light communications (VLC) using a single GaN blue micro- light-emitting diode (LED).
