MEMS

Samsung To Support U.S. Communities in the Fight Against COVID-19

Today, Samsung announced a community outreach donation of $4.3 million in COVID-19 relief to local partners in neighborhoods where a majority of their U.S. employees live and work. These donations build upon their global efforts to date, which now surpass $33 million.

SAP NS2 and Ossia Announce Strategic Alliance Partnership

SAP National Security Services, Inc. (SAP NS2®), a U.S. based independent subsidiary of SAP, today announced an alliance partnership with Ossia Inc. (Ossia), the company behind Cota® Real Wireless Power™. By joining forces, SAP NS2 and Ossia will together deliver unparalleled end-to-end enterprise solutions that helps turn customers’ businesses and operations into intelligent enterprises.

Plasma-Therm Launches New Facility in the United Kingdom

Plasma-Therm, LLC a leading manufacturer of plasma-process equipment for the semiconductor industry, is pleased to announce the opening of its Specialty Process Engineering Group facility in Somerset, England.

MEMS at the Forefront of SARS-CoV-2 Testing

On Saturday, March, 21, 2020 the U.S. Food and Drug Administration (FDA) gave emergency authorization to Cepheid, a California company, to sell a new test for rapid detection of the pandemic coronavirus SARS-CoV-2, which causes COVID-19. Cepheid’s Xpert® Xpress SARS-CoV-2 test gives healthcare workers results in just 45 minutes, with less than a minute of hands-on time for sample preparation.

Eindhoven Researchers Present Revolutionary Light-Emitting Silicon

Emitting light from silicon has been the ‘Holy Grail’ in the microelectronics industry for decades. Solving this puzzle would revolutionize computing, as chips will become faster than ever. Researchers from Eindhoven University of Technology now succeeded: they have developed an alloy with silicon that can emit light. The results have been published in the journal Nature. The team will now start creating a silicon laser to be integrated into current chips.

Cypress Unveils IoT-AdvantEdge Solutions Providing Developers a Trusted Design Path to IoT Edge Products

Cypress Semiconductor Corp. (NASDAQ: CY) today unveiled solutions that give IoT product developers a simplified path to build high-quality, secure, and reliable IoT products. The solutions, branded IoT-AdvantEdge™, include connectivity devices and microcontrollers, software, tools and support, and capabilities from ecosystem partners to slash development complexity by solving critical IoT product design problems.

CEVA Announces Industry’s First High Performance Sensor Hub DSP Architecture

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced SensPro, the industry’s first high performance sensor hub DSP architecture designed to handle the broad range of sensor processing and sensor fusion workloads for contextually-aware devices.

NXP’s New Wi-Fi 6 Portfolio Accelerates its Large-Scale Adoption Across IoT, Auto, Access and Industrial Markets

NXP Semiconductors N.V. today announced the availability of a comprehensive Wi-Fi 6 (802.11ax) portfolio, which significantly expands the number of products and markets able to adopt the latest Wi-Fi standards. NXP’s expanded Wi-Fi 6 portfolio represents the company’s new end-to-end vision and differentiated technology approach that is designed to help usher in an era of connectivity innovation for automotive, access, mobile and Industrial and IoT markets.

COVID-19: Economic and Microelectronics Industry Impacts – Insights from McKinsey & Company

For five days in the latter half of March, the pall of the heavy human and economic toll COVID-19 has exacted in China appeared to be lifting.

Faraday Adopts Synopsys’ Platform Architect and Hybrid Prototyping Solutions to Expand Design Services

Synopsys, Inc. (Nasdaq: SNPS), today announced that Faraday Technology Corporation has expanded their SoC design services to use Synopsys prototyping solutions, including Platform Architect™ for SoC architecture design and optimization, and HAPS® FPGA-based prototyping for hardware and software co-design to accelerate time-to-market.

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