Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.
MEMS
Towards Implementing Neural Networks on Edge IoT Devices
Researchers propose a novel magnetic RAM-based architecture that leverages spintronics to realize smaller, more efficient AI-capable circuits.
Critical Manufacturing Brings Highly Advanced Semiconductor MES Solution to SEMICON Europa
Critical Manufacturing is returning to SEMICON Europa 2024 to showcase its advanced Manufacturing Execution System (MES), tailored to the unique needs of the semiconductor industry.
New DUV Micro-LED Array Advances Maskless Photolithography
A team led by Prof. Sun Haiding from the University of Science and Technology of China (USTC) developed a vertically integrated micro-scale light-emitting diode (micro-LED) array, which was then applied in deep ultraviolet (DUV) maskless photolithography system for the first time.
Earthquake on a Chip: Scientists Harness Sound Waves on the Surface of a Microchip
New chip design uses special glass to allow interactions between light and sound.
GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile
Building on years of collaboration, this new process technology collaboration will provide power-efficient and secure connectivity solutions for essential consumer and industrial applications manufactured both in Europe and the U.S.
HKU Engineering Team Develops Soft Microelectronics Technologies Enabling Wearable AI for Digital Health
Leveraging rapid technological advances for human health is a global trend, driving the rise of biomedical engineering research. A fast-rising field is wearable biosensors, which have the potential to realise digital healthcare and AI medicine.
Gartner Identifies the Top 10 Strategic Technology Trends for 2025
Gartner, Inc. today announced its list of 10 top strategic technology trends that organizations need to explore in 2025. Analysts presented their findings during Gartner IT Symposium/Xpo, taking place here through Thursday.
Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications
Arteris, Inc. today announced an innovative evolution of its network-on-chip (NoC) IP products with tiling capabilities and extended mesh topology support for faster development of Artificial Intelligence (AI) and Machine Learning (ML) compute in system-on-chip (SoC) designs.
SEALSQ and Allion Japan Inc. Partner to Help IoT Device Manufacturers Build Secure, Standard-Compliant Products
The partnership aims to assist IoT device manufacturers in creating secure and standard-compliant products, meeting key protocols such as Matter, and complying with new international IoT security regulations like the EU Cyber Resilience Act (CRA) and the US Cyber Trust Mark.
