The Si2 Compact Model Coalition has announced the approval and financial support of L-UTSOI, a new ultra-thin, silicon-on-insulator transistor simulation model developed by CEA-Leti, a France-based research institute for electronics and information technologies. L-UTSOI was selected for support by CMC, a coalition of 30 semiconductor companies that standardizes semiconductor models used in a class of circuit simulation tools called SPICE, or Simulation Program with Integration Circuit Emphasis.
MEMS
Groovy Key to Nanotubes in 2D
Ultrathin carbon nanotubes crystals could have wonderous uses, like converting waste heat into electricity with near-perfect efficiency, and Rice University engineers have taken a big step toward that goal. The latest step continues a story that began in 2013, when Rice’s Junichiro Kono and his students discovered a breakthrough method for making carbon nanotubes line up in thin films on a filter membrane.
IKBFU Physicists Keep Improving ‘Smart’ Composites for Biomedical Sensors
IKBFU Physicists have successfully tested the new magnetic micro wire-based concept of “smart” composites production. The new composites are related to the multiferroic-class materials which have mutually controlled magnetic and electric properties. The effects observed in the compositions are considered to be a perspective platform for creating new devices from energy converters to highly sensitive sensors.
Due to Concerns Over Coronavirus (COVID-19) Outbreak, the 2020 IEEE International Reliability Physics Symposium Will Be Presented Online as a Virtual Conference
Due to concerns over the global coronavirus (COVID-19) outbreak, the management committee and board of directors of the 2020 IEEE International Reliability Physics Symposium (IRPS), the industry’s premier technical conference for engineers and scientists to present the latest original research in microelectronics reliability, has decided to hold IRPS 2020 as a virtual conference.
New Study Presents Stretchable and Colorless Solar Cells, Using Si Microwire Composites
A research team, led by Professor Kyoung Jin Choi in the School of Materials Science and Engineering at UNIST has introduced a flexible and transparent solar cell, using silicon microwire composites. The new solar cell takes a structure in which cylindrical silicon rods are embedded in a flexible and transparent polymer material. As the visible lights passes between polymer materials without silicon rods, it appears entirely transparent to the human eye. It is also designed to control the sunlight reflected from the silicon rods, thereby increasing efficiency.
Inphi Announces Third Generation, Low-Power Porrima PAM4 Platform for Hyperscale Data Center Networks
Inphi Corporation (NYSE: IPHI), a leader in high-speed data movement interconnects, today announced its new Porrima™ Gen3 Single-Lambda PAM4 platform, the third generation of its industry-leading PAM4 platform solution optimized for hyperscale data center networks. The Porrima Gen3 platform reduces the total module power consumption, lowers total cost of ownership and enables a wider range of lasers, enriching the ecosystem with the next generation of innovation.
Xilinx Launches Industry’s First SmartNIC Platform Bringing Turnkey Network, Storage and Compute Acceleration to Cloud Data Centers
Xilinx, Inc. announced the industry’s first SmartNIC platform delivering true convergence of network, storage and compute acceleration functions on a single device. The Alveo™ U25 SmartNIC is designed to bring the greater efficiency and lower TCO benefits of SmartNICs to cloud service providers, telcos, and private cloud data center operators struggling with increasing networking demands and rising costs.
A Small Step for Atoms, a Giant Leap for Microelectronics
Step by step, scientists are figuring out new ways to extend Moore’s Law. The latest reveals a path toward integrated circuits with two-dimensional transistors. A Rice University scientist and his collaborators in Taiwan and China reported in Nature today that they have successfully grown atom-thick sheets of hexagonal boron nitride (hBN) as two-inch diameter crystals across a wafer.
Integra Technologies Enhances Test Services with Presto Engineering Partnership
Integra Technologies, a global provider of semiconductor services for high reliability applications, announced today a partnership with Presto Engineering’s, San Jose, Calif.-based hub, a provider of test and qualification services to the radiofrequency (RF) market in the U.S. Integra and Presto Engineering have entered into an agreement whereby Presto will consign its existing RF test equipment set, located in its San Jose, Calif. facility, to Integra Technology’s Milpitas, Calif. location.
CEVA Unveils World’s Most Powerful DSP Architecture
CEVA, Inc., a licensor of wireless connectivity and smart sensing technologies, today announced the unveiling of the world’s most powerful DSP architecture, the Gen4 CEVA-XC. This new architecture delivers unmatched performance for the most complex parallel processing workloads required for 5G endpoints and Radio Access Networks (RAN), enterprise access points and other multigigabit low latency applications.
