Samsung Electronics Co., Ltd. today announced it has developed the industry’s first 24-gigabit (Gb) GDDR7 DRAM.
MEMS
Infinera Receives CHIPS and Science Act Funds to Support Development of Semiconductor Technology Important for Communications and National Security
Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHIPS and Science Act.
Forge Nano Receives $10M Investment from GM Ventures
GM plans to utilize Forge Nano’s Atomic Armor surface engineering platform technology to pursue battery cathode material enhancements.
Intel and AMD Form x86 Ecosystem Advisory Group
Intel Corp. and AMD today announced the creation of an x86 ecosystem advisory group bringing together technology leaders to shape the future of the world’s most widely used computing architecture.
Spin-Wave Reservoir Chips Can Prove Revolutionary in the Edge Computing Technology
“Our ultimate goal is to establish edge computing technology utilizing spin-wave reservoir chips, with the aim of developing a wide range of applications including biomedical imaging and autonomous vehicles.” said Sekiguchi.
Seoul Semiconductor’s Patent Enforcement Leads to LED Sales Ban of Infringing Products in Eight European Countries
Seoul Semiconductor Co., Ltd. and its affiliate Seoul Viosys announces that the Unified Patent Court has issued a judgment ordering a sales ban, recall and destruction of products infringing Seoul’s “No Wire” (WICOP) patent in eight European countries.
IMEC Announces Commitments to Automotive Chiplet Program
This week, at an exclusive gathering in Detroit (MI), bringing together the global automotive ecosystem to discuss the evolution towards chiplets in cars (Automotive Chiplet Forum 2024), imec announced that Arm, ASE, BMW Group, Bosch, Cadence Design Systems, Inc., Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo are the first that have committed to join its Automotive Chiplet Program (ACP).
What’s in the October Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the October issue.
Infineon and AWL-Electricity Partner to Improve Wireless Power with GaN Power Semiconductors
Infineon Technologies AG today announced a partnership with Canada-based AWL-Electricity Inc., a pioneer in MHz resonant capacitive coupling power transfer technology.
Research to Use Machine Learning to ’Reverse-Engineer’ New Composite Materials
Professors receive NSF grant for deep-learning model that can customize microarchitecture based on specific needs.
