Accelerating the adoption of solid-state micro speakers in consumer audio products, MEMS audio and semiconductor pioneer xMEMS Labs today announced the availability of two innovative reference designs for purchase at the xMEMS web store.
MEMS
Northeast Microelectronics Coalition Hub Launches PROPEL Manufacturing Program
First-of-its-kind program provides up to $1 million in grant funding for companies to scale microelectronics development in the region.
Towards Next-Gen Functional Materials: Direct Observation of Electron Transfer in Solids
Researchers have developed a new nanotube crystal that enables the direct observation of electron transfer in solids.
New SEMI Foundation Semiconductor PRIDE Initiative to Promote LGBTQ+ Inclusion in Chip Industry Workforce
The SEMI Foundation, the non-profit arm of SEMI, today announced the formation of a new industry-led initiative to advance LGBTQ+ inclusion in the semiconductor workforce.
Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors
Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology.
Development of Revolutionary Color-Tunable Photonic Devices
A team at Pohang University of Science and Technology (POSTECH), spearheaded by Professor Su Seok Choi and Ph.D. candidate Seungmin Nam from the Department of Electrical Engineering, has developed a novel stretchable photonic device that can control light wavelengths in all directions.
Navajo Technical University Partners with NSF Center
A partnership that began in 2017 between Navajo Technical University (NTU) and the U.S. National Science Foundation Materials Research Science and Engineering Center at Harvard University is providing Navajo students with new opportunities to pursue advanced degrees in science and engineering while helping to address critical issues facing the Navajo Nation.
CEA-Leti Reports Three-Layer Integration Breakthrough On the Path for Offering AI-Embedded CMOS Image Sensor
CEA-Leti scientists reported a series of successes in three related projects at ECTC 2024 that are key steps to enabling a new generation of CMOS image sensors (CIS) that can exploit all the image data to perceive a scene, understand the situation and intervene in it – capabilities that require embedding AI in the sensor.
Himax Announces Strategic Investment in Obsidian Sensors
Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, today announced its strategic investment in Obsidian Sensors, Inc., a San Diego-based thermal imaging sensor solution manufacturer.
New Survey to Access Job Skills Needs in Europe’s Microelectronics Industry
SEMI invites key industry stakeholders to participate in a survey designed to access job skills in highest demand in Europe’s microelectronics industry in 2024.
