Recognizing innovations and other outstanding accomplishments in Flexible Hybrid Electronics (FHE), SEMI-FlexTech, a SEMI Strategic Association Partner, yesterday presented the 2020 FLEXI Awards at the 19th annual FLEX 2020 Conference and Exhibition in San Jose, California. The FLEXI Awards spotlight FHE contributions in five categories: R&D Achievement, Product Innovation and Commercialization, Technology & Education in Leadership, Technology Champion and Industry Leadership.
MEMS
GLOBALFOUNDRIES Delivers Industry’s First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications
GLOBALFOUNDRIES® (GF®) today announced its embedded magnetoresistive non-volatile memory (eMRAM) on the company’s 22nm FD-SOI (22FDX®) platform has entered production, and GF is working with several clients with multiple production tape-outs scheduled in 2020. Today’s announcement represents a significant industry milestone, demonstrating the scalability of eMRAM as a cost-effective option at advanced process nodes for Internet of Things (IoT), general-purpose microcontrollers, automotive, edge-AI (Artificial Intelligence), and other low-power applications.
Prophesee and Sony Develop a Stacked Event-Based Vision Sensor
The new sensor and its performance results were announced at the International Solid-State Circuits Conference (ISSCC) held in San Francisco in the United States, starting on February 16, 2020. The new stacked Event-based vision sensor detects changes in the luminance of each pixel asynchronously and outputs data including coordinates and time only for the pixels where a change is detected, thereby enabling high efficiency, high speed, low latency data output. This vision sensor achieves high resolution, high speed, and high time resolution despite its small size and low power consumption.
GlobalSign and Infineon Combine Forces to Strengthen IoT Device Identity
GMO GlobalSign (www.globalsign.com), a global Certificate Authority (CA) and leading provider of identity and security solutions for the Internet of Things (IoT), and semiconductor manufacturer Infineon Technologies AG, today announced a solution that secures, simplifies, and streamlines device enrollment into Microsoft Azure IoT Hub and IoT Hub Device Provisioning Service. The collaboration eases complex device identity integration challenges and delivers a proven path for IoT device security literally from chip to cloud.
IAR Systems Extends Arm Tools Offering With Support for Renesas Electronics’ RA Family
Today, IAR Systems® announces full coverage for the RA Arm® Cortex® microcontrollers (MCUs) from Renesas Electronics Corporation. The complete development toolchain IAR Embedded Workbench® provides powerful code optimizations and comprehensive debugging features in an easy-to-use integrated development environment with excellent worldwide technical support and training.
Roger Grace Announces Call for Abstracts
Roger Grace, President of Roger Grace Associates, the leading marketing consultancy specializing in Sensors and MEMS, has announced the call for abstracts for the all-day June 22, 2020 Pre-Conference Symposium during Sensors Expo & Conference, taking place at the McEnery Convention Center in San Jose, CA. Interested presenters are requested to submit abstracts of between 150-200 words as attached documents no later than March 16, 2020 and sent to Roger Grace, Symposium Chair, at rgrace@rgrace.com.
A Spookily Good Sensor
Scientists from the Research Center for Advanced Science and Technology (RCAST) at The University of Tokyo demonstrated a method for coupling a magnetic sphere with a sensor via the strange power of quantum entanglement. They showed that the existence of even a single magnetic excitation in the sphere could be detected with a one-shot measurement. This work represents a major advancement toward quantum systems that can interact with magnetic materials.
Questex’s Sensors Expo & Conference 2020 Adds New Features Aimed at Educating and Showcasing “What’s Next” for Rapidly Evolving Industry
Sensors Expo & Conference unveiled the widely anticipated 2020 Conference Program. Taking place June 22-24 at the McEnery Convention Center in San Jose, California, the 35th annual event will build upon its legacy of showcasing and educating on innovative sensor technology and dive deeper into the technologies, systems, and applications where sensors play a critical role – including the Internet of Things, Autonomous Technologies, and Embedded Systems.
STMicroelectronics and TSMC Collaborate to Accelerate Market Adoption of Gallium Nitride-Based Products
STMicroelectronics (NYSE:STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and TSMC (TWSE:2330, NYSE: TSM), the world’s largest dedicated semiconductor foundry, are collaborating to accelerate the development of Gallium Nitride (GaN) process technology and the supply of both discrete and integrated GaN devices to market. Through this collaboration, ST’s innovative and strategic GaN products will be manufactured using TSMC’s leading GaN process technology.
Veteran Technologist Tim Brosnihan Appointed Executive Director of SEMI MEMS & Sensors Industry Group
SEMI today announced the appointment of Timothy Brosnihan as Executive Director of the MEMS & Sensors Industry Group (MSIG), a SEMI Strategic Association Partner. A skilled electronics industry executive and seasoned technologist, Brosnihan brings to MSIG extensive MEMS and sensors, product development and manufacturing experience. In his new role, he will direct MSIG global activities including its research and development, standards, and technical programs. Brosnihan will also spearhead MSIG executive conferences and develop new services for the MEMS and sensors industry.
