Wright Williams & Kelly, Inc. (WWK) (https://wwk.com), the global leader in Cloud-based cost and productivity management software and consulting services, announced today that it is offering access to its software platforms at cost to any organization shifting production to help fight the Covid-19 virus.
MEMS
Power Integrations Names Anita Ganti to Its Board of Directors
Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced that Anita Ganti will join the company’s board of directors on April 1, 2020. Mrs. Ganti is a seasoned leader in the technology sector, with extensive experience in the analog semiconductor industry. From 2015 to 2019 she served as senior vice president of the product engineering services organization of Wipro Limited.
IAR Systems Extends Capabilities for Safety-Critical Applications Based on Renesas RX MCUs
IAR Systems®, the future-proof supplier of software tools and services for embedded development, launches a new version of its functional safety edition of IAR Embedded Workbench® for Renesas’ RX Family of microcontrollers (MCUs). This new version adds extended capabilities including IDE features for improved user experience, stack protection and support for the latest C18 and C++17 language standards. In addition, the toolchain now supports the latest RX devices including the…
“Black Swan” Event Triggers Revision to 2020 IC Market Forecast
The recent surge of the spread of the coronavirus (Covid-19) and its anticipated negative impact on the global economy and IC market definitely fits the definition of a Black Swan event.
Fish Scales Could Make Wearable Electronics More Sustainable
Flexible temporary electronic displays may one day make it possible to sport a glowing tattoo or check a reading, like that of a stopwatch, directly on the skin. In its current form, however, this technology generally depends on plastic. New research in ACS Nano describes a way to make these displays, which would likely be discarded after a single use, more environmentally friendly using a plentiful and biodegradable resource: fish scales.
Synopsys Introduces Machine Learning-Based Auto Segmentation Module for 3D Image Processing
Synopsys, Inc. (Nasdaq: SNPS) today announced the release of a major update to Simpleware™ ScanIP software, which extends its capabilities for segmenting anatomical regions through a new module, Simpleware AS Ortho (Auto Segmenter for Orthopedics). This new product offering is a machine learning (ML)-based auto segmentation module that builds on Synopsys’ ScanIP software, a comprehensive solution for 3D image processing and segmenting images generated by computed tomography (CT) or magnetic resonance imaging (MRI) scanners.
Infineon and pmdtechnologies Collaborate With Qualcomm to Enable High-Quality Standard Solution for 3D Authentication
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) worked with Qualcomm Technologies, Inc. to develop a reference design for 3D authentication based on the Qualcomm® Snapdragon™ 865 Mobile Platform. Infineon is thus extending its application portfolio of its 3D sensor technology for mobile devices.
Park Systems Announces $1 Million Dollar Nano Research Grant Fund for Researchers Setting up Nanoscience Labs in North America
Park Systems, world-leading manufacturer of Atomic Force Microscopes, announces a $1 Million Dollar Nano Research Grant Fund to support researchers who are starting new nanoscience labs in North America. The Park Systems Nano Research Grant Fund provides up to twenty grants of $50,000 towards the purchase of any AFM system and accessories manufactured by Park Systems.
Transistor Count Trends Continue to Track with Moore’s Law
Though growth rates in some product categories have slowed, doubling of transistors per chip every two years remains a guideline that the industry continues to follow.
Si2 Compact Model Coalition to Support CEA-Leti SPICE Simulation Model
The Si2 Compact Model Coalition has announced the approval and financial support of L-UTSOI, a new ultra-thin, silicon-on-insulator transistor simulation model developed by CEA-Leti, a France-based research institute for electronics and information technologies. L-UTSOI was selected for support by CMC, a coalition of 30 semiconductor companies that standardizes semiconductor models used in a class of circuit simulation tools called SPICE, or Simulation Program with Integration Circuit Emphasis.
