Keysight Technologies, Inc., a leading technology company that helps enterprises, service providers, and governments accelerate innovation to connect and secure the world, announced that Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated, is working with the company to accelerate small cell deployment supported by 5G virtualized radio access network (vRAN) architecture.
MEMS
EV Group Establishes Heterogenous Integration Competence Center
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established the Heterogeneous Integration Competence Center™, which is designed to assist customers in leveraging EVG’s process solutions and expertise to enable new and enhanced products and applications driven by advances in system integration and packaging.
Scientists Succeed in Measuring Electron Spin Qubit Without Demolishing It
A group of scientists from the RIKEN Center for Emergent Matter Science in Japan have succeeded in taking repeated measurements of the spin of an electron in a silicon quantum dot (QD), without changing the spin in the process. This type of “non-demolition” measurement is important for creating quantum computers that are fault tolerant.
Stress-Relief Substrate Helps OLED Stretch Two-Dimensionally?
Highly functional and free-form displays are critical components to complete the technological prowess of wearable electronics, robotics, and human-machine interfaces. A KAIST team created stretchable OLEDs (Organic Light-Emitting Diodes) that are compliant and maintain their performance under high-strain deformation. Their stress-relief substrates have a unique structure and utilize pillar arrays to reduce the stress on the active areas of devices when strain is applied.
SEMI-FlexTech Announces 2020 FLEXI Awards Winners for Outstanding Achievements in Flexible Hybrid Electronics
Recognizing innovations and other outstanding accomplishments in Flexible Hybrid Electronics (FHE), SEMI-FlexTech, a SEMI Strategic Association Partner, yesterday presented the 2020 FLEXI Awards at the 19th annual FLEX 2020 Conference and Exhibition in San Jose, California. The FLEXI Awards spotlight FHE contributions in five categories: R&D Achievement, Product Innovation and Commercialization, Technology & Education in Leadership, Technology Champion and Industry Leadership.
GLOBALFOUNDRIES Delivers Industry’s First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications
GLOBALFOUNDRIES® (GF®) today announced its embedded magnetoresistive non-volatile memory (eMRAM) on the company’s 22nm FD-SOI (22FDX®) platform has entered production, and GF is working with several clients with multiple production tape-outs scheduled in 2020. Today’s announcement represents a significant industry milestone, demonstrating the scalability of eMRAM as a cost-effective option at advanced process nodes for Internet of Things (IoT), general-purpose microcontrollers, automotive, edge-AI (Artificial Intelligence), and other low-power applications.
Prophesee and Sony Develop a Stacked Event-Based Vision Sensor
The new sensor and its performance results were announced at the International Solid-State Circuits Conference (ISSCC) held in San Francisco in the United States, starting on February 16, 2020. The new stacked Event-based vision sensor detects changes in the luminance of each pixel asynchronously and outputs data including coordinates and time only for the pixels where a change is detected, thereby enabling high efficiency, high speed, low latency data output. This vision sensor achieves high resolution, high speed, and high time resolution despite its small size and low power consumption.
GlobalSign and Infineon Combine Forces to Strengthen IoT Device Identity
GMO GlobalSign (www.globalsign.com), a global Certificate Authority (CA) and leading provider of identity and security solutions for the Internet of Things (IoT), and semiconductor manufacturer Infineon Technologies AG, today announced a solution that secures, simplifies, and streamlines device enrollment into Microsoft Azure IoT Hub and IoT Hub Device Provisioning Service. The collaboration eases complex device identity integration challenges and delivers a proven path for IoT device security literally from chip to cloud.
IAR Systems Extends Arm Tools Offering With Support for Renesas Electronics’ RA Family
Today, IAR Systems® announces full coverage for the RA Arm® Cortex® microcontrollers (MCUs) from Renesas Electronics Corporation. The complete development toolchain IAR Embedded Workbench® provides powerful code optimizations and comprehensive debugging features in an easy-to-use integrated development environment with excellent worldwide technical support and training.
Roger Grace Announces Call for Abstracts
Roger Grace, President of Roger Grace Associates, the leading marketing consultancy specializing in Sensors and MEMS, has announced the call for abstracts for the all-day June 22, 2020 Pre-Conference Symposium during Sensors Expo & Conference, taking place at the McEnery Convention Center in San Jose, CA. Interested presenters are requested to submit abstracts of between 150-200 words as attached documents no later than March 16, 2020 and sent to Roger Grace, Symposium Chair, at rgrace@rgrace.com.
