LiFi, or visible-light communication, has significant advantages over WiFi, such as data-transmission speed and the data security it offers because light does not penetrate walls. But wide adoption is constrained primarily because of interference between devices using LiFi networks and LiFi’s resulting poor performance in large areas. Until now. CEA-Leti’s LiFi-multicell system is the first-ever smart interference orchestrator that automatically detects interference between lighting zones in networks and optimizes data transmission rates for each nearby device. The system also manages—asymmetrically and independently—uplink/downlink interference.
MEMS
ON Semiconductor to Demonstrate Intelligent IoT Technologies Including Advanced Audio Processing at CES 2020
ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, will showcase a wide range of innovative technologies for smart homes, connected buildings and personal IoT at CES 2020. The rise of voice control and Voice User Interfaces (VUI) has made audio processing critical to the success of a wide range of building automation and household applications. ON Semiconductor will feature two demonstrations using its LC823455, which provides key features for portable sound solutions and support for VUI. A Strata-enabled stereo speaker capable of streaming music over Bluetooth® will show various advanced audio functionalities including touch sensor-based volume control and voice commands. The LC823455 will also be featured in a cloud-based VUI demonstration for communication with IoT edge-nodes applications.
In Breakthrough Method of Creating Solar Material, NREL Scientists Prove the Impossible Really Isn’t
Scientists at the National Renewable Energy Laboratory (NREL) achieved a technological breakthrough for solar cells previously thought impossible. The scientists successfully integrated an aluminum source into their hydride vapor phase epitaxy (HVPE) reactor, then demonstrated the growth of the semiconductors aluminum indium phosphide (AlInP) and aluminum gallium indium phosphide (AlGaInP) for the first time by this technique.
FLEX and MSTC 2020 to Showcase Flexible Hybrid Electronics, MEMS and Sensors Innovations for More Personalized Applications
Flexible hybrid electronics breakthroughs are driving the next wave of smart MEMS and sensing solutions for more personalized, portable electronics, setting the stage for the co-located Flexible Hybrid Electronics Conference and Exhibition (FLEX) and MEMS & Sensors Technical Congress (MSTC) Feb. 24-27, 2020. Co-sponsored by SEMI FlexTech and SEMI MEMS & Sensors Industry Group, FLEX and MSTC will gather more than 100 global experts for market and technical presentations, tech courses, and more than 50 exhibit opportunities for connecting with industry visionaries at the DoubleTree by Hilton Hotel in San Jose, Calif. Registration is now open.
ULVAC Inc. and Silex Microsystems AB Sign Joint Development Agreement on Leading-Edge Sputtered PZT for MEMS
ULVAC, Inc. (ULVAC), headquartered in Kanagawa, Japan and lead by CEO Setsuo Iwashita and SILEX Microsystems AB (Silex), headquartered in Järfälla, Sweden and lead by CEO Edvard Kälvesten, today announced they have signed an agreement to develop a production thin film piezoelectric process (PZT) for MEMS actuators and sensors with cutting edge performance and reliability.
Member of the Executive Board of the HARTING Technology Group Honored with the Karmarsch Medal
Dr.-Ing. e. h. Dietmar Harting has been honoured with the Karmarsch Medal of the Leibniz University Society Hanover e.V. for his outstanding commitment as a shaper and supporter of technology, science and industry. The speech of congratulations was given by former German President Christian Wulff. Dietmar Harting, longstanding CEO and personally liable partner of the HARTING Technology Group, was actively engaged as president of national and international associations and bodies for norm setting, standardisation and innovation, thereby contributing significantly to the positive development of the German electronics and electrical engineering industry.
Kandou Demonstrates Prototype of First USB4 Multiprotocol Retimer at CES
Kandou, an innovative leader in high-speed, energy efficient, chip-to-chip link solutions, will demonstrate a working prototype of the industry’s first USB-C® multiprotocol retimer solution with USB4™ support at CES January 7-10 in Las Vegas, Nev. The prototype will showcase the benefits of Kandou’s Matterhorn USB Type-C® 40 GB/s multiprotocol switch and bidirectional bit-level retimer solution for faster video processing and data transfer connections to drive next-generation USB-enabled devices. It follows the USB Implementers Forum (USB-IF) specification for USB4 and targets a wide range of applications that include mobile, tablet and desktop PCs, active cables, monitors, docking stations, external hard solid-state drives, and gaming consoles.
Weebit Moving Towards Commercialisation Ahead of Schedule, with External Technology Verification by XTX
Weebit Nano (ASX: WBT), a developer of next generation memory technology for the global semiconductor industry, is pleased to advise that it is now working with XTX Technology – a Chinese provider of high quality memory solutions for consumer electronics, industrial embedded systems, telecom and networking markets – to enable the adoption of Weebit’s silicon oxide ReRAM technology by XTX.
CEA-Leti Builds Fully Integrated Bio-Inspired Neural Network with RRAM-Based Synapses and Analogue Spiking Neurons
Leti, a technology research institute of CEA Tech, has fabricated a fully integrated bio-inspired neural network, combining resistive-RAM-based synapses and analog spiking neurons. The functionality of this proof-of-concept circuit was demonstrated thanks to handwritten digits classification. Resistive-RAM (RRAM) is a type of non-volatile random-access computer memory that works by changing the resistance across a dielectric solid-state material. The research work presented at IEDM 2019 measured a 5x reduction in energy use compared to an equivalent chip using formal coding. The neural network implementation is made such that synapses are placed close to neurons, which enables direct synaptic current integration.
Artilux Unveils World’s First GeSi Wide Spectrum 3D Sensor at CES
At CES 2020, Artilux, an innovator in photonics and electronics technology, will be unveiling its Explore Series, the world’s first wide spectrum 3D ToF (time-of-flight) sensor based on GeSi (germanium-on-silicon) photonic innovation. Operating at longer NIR (near infared) wavelengths, the sensor can be used in the area of the spectrum that is more than 10 times safer than the currently-used 940nm wavelength, as well as improving sensing accuracy and performance under sunlight. The demo, being shown live for the first time, will include a RGB-D camera for logistics applications and robot vision, and a 3D camera system that can operate at a longer wavelength. The sensor is projected to enter mass production in Q1 2020 and targets applications that will benefit from the improved 3D sensing performance such as mobile devices, automotive LiDAR, and machine vision.
