The upcoming 2020 IEEE International Reliability Physics Symposium (IRPS), the industry’s premier technical conference for engineers and scientists to present the latest original research in microelectronics reliability, will be held in Dallas, TX from March 29 – April 2, 2020 at the Hilton DFW Lakes Executive Conference Center. The Symposium will feature a number of special focus sessions highlighting novel and emerging areas of electronic reliability, as well as topics relating to conventional semiconductor, integrated circuit, and microelectronic assembly reliability.
MEMS
SemiQ Announces Next Generation 650V, 1200V, and 1700V Silicon Carbide Schottky Diode Family
SemiQ (previously Global Power Technologies Group) recently announced the release to production of its new 3rd generation SiC Diode Family featuring blocking voltages of 650V, 1200V and 1700V with forward-current starting at 8 amps up to 50 A per chip. Packages include TO-220-2L, TO-220-3L, TO-247-2L, TO-247-3L, SOT-227, TO-263 as well as bare die.
SEMI Talent Forum to Help Build Next-Generation Chip Industry Workforce
Post-graduates and onboarding talent will connect with local companies to explore semiconductor industry career paths and employment opportunities at the SEMI Talent Forum, 6 March 2020 in Swansea, UKat the University of Swansea. Sponsored by SEMI, the industry association representing the global electronics manufacturing and design supply chain, and staged in partnership with European organizations including the University of Swansea, Edwards, Oxford Instruments, and SPTS Technologies, the event will also highlight how technology is reshaping the global workforce. Participation is free of charge and registration is open.
MEMS-FHE Device Integration Gets Real
MEMS technology has changed human interaction with electronic devices. Introduced in the 1990s, the first mass-market MEMS devices were used for inkjet printheads and automotive airbag crash sensors. Today, MEMS are ubiquitous, with billions of the tiny devices adding intelligence and interactivity to smartphones, smart speakers, wearables, automobiles, biomedical devices, remote monitoring and event detection systems, and countless other applications. Integrating MEMS with Flexible Hybrid Electronics (FHE) is an important step in the evolution of this miniaturized intelligent sensing technology, paving the way for its use in new classes of flexible, conformal devices.
MEMS Market to Reach $28.4B by 2029
Micro-electromechanical systems offer significant benefits such as time-efficient, effective power consumption, and reduced weight as compared to traditional macro systems for mechanical and electrical functions. These benefits make MEMS-based devices more attractive for communication and connectivity applications.
STMicroelectronics Unveils Secure Cellular-Connectivity Offering for Industrial IoT and Automotive Applications
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, in collaboration with trusted partners, has created a complete ecosystem for securely connecting Industrial IoT (IIoT) and automotive systems to cellular networks.
Presto Engineering Acquires DELTA Microelectronics Business from FORCE Technology
Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announced today that it has acquired the DELTA Microelectronics business unit of FORCE Technology, the European leader in ASIC supply chain services. With this acquisition, Presto adds ASIC design to its suite of services for the Industry 4.0, IoT, and autonomous driving market.
Hprobe, Leader in Magnetic Field Testing Announces Completion of a New Funding Round with International Investors
Hprobe, a provider of semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced the completion of a new funding round driven by international investors, providing an exceptional depth of expertise, a global ecosystem of partnerships and the endorsement of industry market leaders. The company has raised more than 2 million euros to support its strong international development in the field of spintronics based devices testing, such as MRAMs (Magnetic Random Access Memories) and TMR (Tunnel Magneto Resistance) sensors.
Dow Introduces First Solventless Silicone Conformal Coating with UV and Moisture Dual Cure
Dow (NYSE: Dow), introduced today at IPC APEX EXPO 2020 new DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating, the industry’s first solventless silicone conformal coating with an ultraviolet (UV) and moisture dual cure system for high throughputs. This new environmentally responsible silicone technology promotes sustainability, health and safety while reducing processing costs through automated spraying and fast, energy-efficient UV curing.
2019 Global Silicon Shipments Dip From 2018 Record High But Revenue Remained Stable Above $11 Billion
Worldwide silicon wafer area shipments in 2019 declined 7 percent from the 2018 record high while revenue remained above the $11 billion mark despite a global silicon revenue slip of 2 percent over the same period, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry. Silicon wafer area shipments in 2019 totaled 11,810 million square inches (MSI), while the industry logged shipments of 12,732 million square inches in 2018. Revenues in 2019 totaled $11.15 billion, edging down from the $11.38 billion posted in 2018.
