MEMS

SWAP Hub Team Awarded CHIPS Act Funded Project

The Deptartment of Defense has announced that the Southwest Advanced Prototyping (SWAP) Hub based at Arizona State University (ASU) has been awarded $5M in funding by the CHIPS and Science Act for a Multi-MHz, High Density, Ultra-fast RADAR Power Convert project that will advance radar power systems in critical defense applications.

Sivers Semiconductors Receives CHIPS Act Funding Award from NEMC Hub

$6M award accelerates lab-to-fab development of critical chip technology.

Natcast Launches National Semiconductor Technology Center Membership Program

Public-private consortium will focus on innovation, collaboration, and education to bolster the U.S. semiconductor industry…

An Edible Toothpaste-Based Transistor

A toothpaste-based transistor is the latest innovation from the research team at the Istituto Italiano di Tecnologia (IIT-Italian Institute of Technology) in Milan, which pushes the boundaries of edible electronics.

Critical Manufacturing Welcomes Jeff Winter as Head of Business Strategy

Critical Manufacturing announced the appointment of Jeff Winter as VP of Business Strategy.

Silicon Creations Awarded TSMC’s 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP

Silicon Creations announced that it has been named a 2024 TSMC Open Innovation Platform (OIP) Partner of the Year for Mixed Signal IP.

Renesas Leads ADAS Innovation with Power-Efficient 4th-Generation R-Car Automotive SoCs

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today expanded its popular R-Car Family of system-on-chips (SoCs) for entry-level Advanced Driver Assistance Systems (ADAS).

Samsung Electronics Develops Industry’s First Automotive SSD Based on 8th-Generation V-NAND

Samsung Electronics Co., Ltd. today announced it has successfully developed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical NAND (V-NAND)

A New Ventilator-on-a-Chip Model to Study Lung Damage

In a new study, using a ventilator-on-a-chip model developed at The Ohio State University, researchers found that shear stress from the collapse and reopening of the air sacs is the most injurious type of damage.

The MMEC Receives Microelectronics Commons Project Awards

The Midwest Microelectronics Consortium (MMEC) announced the award of five technology development projects through Microelectronics Commons

Featured Products