The semiconductor industry has delivered breakthrough innovations in computer pro- cessing power and miniaturization over the last 70 years. Could it deliver similar results in the field of healthcare? That was the question addressed by Paru Deshpande, VP Life Sciences & Imaging at imec during a talk on Monday during imec’s International Technology Forum at the Grand Hyatt in San Francisco.
MEMS
‘Tsunami’ On a Silicon Chip: A World First For Light Waves
A tsunami holds its wave shape over very long distances across the ocean, retaining its power and ‘information’ far from its source. In communications science, retaining information in an optic fibre that spans continents is vital. Ideally, this requires the manipulation of light in silicon chips at the source and reception end of the fibre without altering the wave shape of the photonic packet of information. Doing so has eluded…
Global Semiconductor Sales Decrease 14.6 Percent Year-to-Year in May
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors were $33.1 billion in May 2019, a decrease of 14.6 percent from the May 2018 total of $38.7 billion and 1.9 percent more than the April 2019 total of $32.5 billion. Monthly sales are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. SIA represents U.S. leadership in semiconductor manufacturing, design, and research. “Global semiconductor sales fell well short last year’s monthly total in May,…
EV Group Revolutionizes Lithography With New Maskless Exposure Technology
EV Group (EVG) today unveiled MLE (Maskless Exposure), a revolutionary next-generation lithography technology developed to address future back-end lithography needs for advanced packaging, MEMS, biomedical and high-density printed circuit board (PCB) applications.
Smart Parking and Sensors in the Age of IoT
Poorly managed parking resources have a substantial negative impact on cities — one that has been well-documented.
CEA-Leti & Radiall to Design Innovative RF Components for 5G Networks and Photonics Components for Harsh Environments
Leti, a research institute of CEA Tech, and Radiall, a global manufacturer of leading-edge interconnect solutions, announced a five-year common lab to design innovative antennas, radio frequency (RF) to meet infrastructure requirements of 5G networks and photonics components for harsh environments.
SEMI Teams with Cornell University To Accelerate Technology Development Using Machine Learning and AI
SEMI today announced a research and development (R&D) project to speed technology progress and problem-solving in microelectronics manufacturing and across the supply chain by driving new efficiencies using machine learning (ML) and artificial intelligence (AI).
CEA’s Precise Localization Technology Boosts Quality Control and Efficiency in Desoutter’s Products
Desoutter Industrial Tools and CEA-Leti today announced a precise, new indoor-location system that enables factories to…
TDK Announces Worldwide Availability of MEMS-Based “Sonar on a Silicon Chip” Ultrasonic Time-of-Flight Sensors
TDK Corporation’s (TSE:6762) announces the immediate worldwide availability of the Chirp CH-101 MEMS-based ultrasonic Time-of-Flight…
A New ‘Golden’ Age For Electronics?
One way that heat damages electronic equipment is it makes components expand at different rates,…
