Boréas Technologies, developer of ultra-low-power haptic technologies, today introduced the BOS1901CW, a Wafer Level Chip Scale (WLCSP) version of its flagship low-power piezoelectric driver integrated circuit (IC) for high-definition (HD) haptic feedback in mobile and wearable consumer products, including buttonless smartphones, smartwatches, game controllers and other battery-powered devices. Featuring WLCSP packaging, the BOS1901CW is just 2.1×2.2×0.6 mm and consumes just one-tenth the power of its nearest piezoelectric (piezo) competitor, making it small and low-power enough for the most resource-constrained devices.
MEMS
Properties of Graphene Change Due to Water And Oxygen
The research team consisted of Professor Sunmin Ryu, Kwanghee Park, and Haneul Kang, affiliated with Department of Chemistry, POSTECH, discovered that the doping of two-dimensional materials with influx of charges from outside in the air is by an electrochemical reaction driven by the redox couples of water and oxygen molecules. Using real-time photoluminescence imaging, they observed the electrochemical redox reaction between tungsten disulfide and oxygen/water in the air. According to their study¸ the redox reaction can control the physical properties of two-dimensional materials which can be applied to bendable imaging element, high-speed transistor, next generation battery, ultralight material and other two-dimensional semiconductor applications.
Towards High Quality ZnO Quantum Dots Prospective for Biomedical Applications
Recently, scientists from the Institute of Physical Chemistry of the Polish Academy of Sciences (IPC PAS) and Warsaw University of Technology (WUT) in cooperation with the Interdisciplinary Research Institute of Grenoble (IRIG) used dynamic nuclear polarization (DNP)-enhanced solid state nuclear magnetic resonance (NMR) spectroscopy for detailed characterization of the organic-inorganic interfaces of ZnO QDs prepared by the traditional sol-gel process and the recently developed one-pot self-supporting organometallic (OSSOM) procedure.
Armored With Plastic ‘Hair’ and Silica Shell, New Perovskite Nanocrystals Show Enhanced Durability
Perovskite nanocrystals hold promise for improving a wide variety of optoelectronic devices – from lasers to light emitting diodes (LEDs) – but problems with their durability still limit the material’s broad commercial use. Researchers at the Georgia Institute of Technology have demonstrated a novel approach aimed at addressing the material’s durability problem: encasing the perovskite inside a double-layer protection system made from plastic and silica.
Intel Completes Sale of Smartphone Modem Business to Apple
Intel Corporation today announced it has completed the sale of the majority of its smartphone modem business to Apple. This transaction, valued at $1 billion, was announced on July 25, 2019. As previously disclosed, this transaction enables Intel to focus on developing technology for 5G networks while retaining the option to develop modems for non-smartphone applications, such as PCs, internet of things devices and autonomous vehicles.
STMicroelectronics Ships 1 Billionth Time-of-Flight Module
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced the shipment of its 1 billionth Time-of-Flight (ToF) module. ST’s ToF sensors utilize the Company’s Single Photon Avalanche Diode (SPAD) sensor technology and are manufactured in ST’s 300mm front-end wafer fab in Crolles, France. The final module, which integrates the SPAD sensor, a Vertical Cavity Surface Emission Laser (VCSEL), and the necessary optical elements to enable the product’s outstanding performance, is assembled and tested in ST’s state-of-the-art internal back-end facilities.
Industry Strategy Symposium 2020 to Highlight Data-Driven Innovation and Growth
SEMI announced today that Industry Strategy Symposium (ISS) 2020 will take place January 12-15 at the Ritz-Carlton in Half Moon Bay, Calif. with the theme Data Driven Innovation and Growth. ISS is the year’s first executive check-in, offering perspectives from leading analysts, researchers, economists, and technologists on forces impacting the semiconductor industry. The annual symposium provides insights into growth opportunities and industry intelligence to help inform company business plans and forecasts based on current market conditions. Registration is now open.
AMETEK France Opens New Technology Solutions Centre in Élancourt City
AMETEK France has established a Technology Solutions Centre as a regional headquarters in Élancourt City to support the growth of its electronic instrument and electromechanical product businesses in France. AMETEK France’s goal was to build a resource for showcasing the latest products and technologies from a variety of AMETEK businesses. The centre will serve as a hub of innovation for the European markets. Customers from across the region will have access to live demos, training sessions and top-of-the-line service to meet application needs. Overall, the facility will enhance the relationship between AMETEK and its end users, effectively sustaining a variety of different industries.
A Super-Fast ‘Light Switch’ for Future Cars and Computers
Self-driving cars have become better and more reliable in recent years. Before they might be allowed to drive completely autonomously on our roads in the near future, however, a few hurdles have to be taken. Above all, the need to assess the surroundings at lightning speed and to recognize people and obstacles takes current technologies to its limits. A team of scientists led by Juerg Leuthold at the Institute for Electromagnetic Fields at ETH Zurich, together with colleagues at the National Institute of Standards and Technology (NIST) in the USA and at Chalmers University in Gothenburg (Sweden), has now developed a novel electro-opto-mechanical switch that might be able to elegantly solve both problems in the future.
Industry’s First 4Mbit EEPROM Memory Chips from STMicroelectronics Let Small Devices Handle Bigger User Data
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced a new generation of memory chips that combine unprecedented storage density with speed and reliability, enabling the devices we use every day to do more to enrich life and work. With 4Mbit capacity, ST’s new EEPROM memories let small devices capture and store more data through the serial SPI bus. This enables equipment such as smart meters to intensify data logging for managing grids more effectively and providing more user-friendly billing. Also, portable medical devices can log patients’ data more intensively to improve care quality, and consumer devices such as smart wearables can support more user features and greater precision. In these applications, the memory’s low power consumption helps extend battery runtime. A wide range of applications in industrial controls and communication infrastructure such as network switches can also benefit from these higher density memories.
