MEMS

CEA-Leti Reports Three-Layer Integration Breakthrough On the Path for Offering AI-Embedded CMOS Image Sensor

CEA-Leti scientists reported a series of successes in three related projects at ECTC 2024 that are key steps to enabling a new generation of CMOS image sensors (CIS) that can exploit all the image data to perceive a scene, understand the situation and intervene in it – capabilities that require embedding AI in the sensor.

Himax Announces Strategic Investment in Obsidian Sensors

Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, today announced its strategic investment in Obsidian Sensors, Inc., a San Diego-based thermal imaging sensor solution manufacturer.

New Survey to Access Job Skills Needs in Europe’s Microelectronics Industry

SEMI invites key industry stakeholders to participate in a survey designed to access job skills in highest demand in Europe’s microelectronics industry in 2024.

IEEE International Electron Devices Meeting (IEDM) Announces 2024 Call for Papers

Under the theme “Shaping Tomorrow’s Semiconductor Technology,” the 70th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.

EV Group Doubles Throughput of Semiconductor Layer Transfer Tech with EVG LayerRelease System

Dedicated HVM equipment platform boosts productivity and lowers cost-of-ownership of novel infrared laser release technology through silicon carrier wafers for 3D integration applications.

NY CREATES and Raytheon Unveil Collaborative Semiconductor Workforce Training Initiative

The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES), in collaboration with Raytheon, an RTX business, announced the deployment of the NY CREATES/Raytheon Workforce Training Program.

SEALSQ RISC-V Chips Adoption is Predicted to Get AI Boost Making it a Viable Competitor to Traditional GPUs

RISC-V technology is revolutionizing the microchip industry, challenging established giants and paving the way for transformative changes. By the end of 2022, the industry had already embraced over 10 billion RISC-V cores, with thousands of engineers globally contributing to RISC-V projects.

The Dominican Republic and Purdue University Sign MOU to Drive Semiconductor Growth

The Ministry of Industry, Commerce, and MSMEs of the Dominican Republic (MICM) announced a significant Memorandum of Understanding (MOU) with Purdue University to propel the country’s semiconductor industry and national development.

Wearable Devices Get Signal Boost from Innovative Material

Rice engineer and collaborators overcome radio frequency performance challenges in skin-interfaced electronics.

Andes Technology and Arteris Partner To Accelerate RISC-V SoC Adoption

Andes Technology and Arteris partnership aims to support the growing adoption of RISC-V SoCs by mutual customers.

Featured Products