MEMS

STMicroelectronics Joins Quintauris as Sixth Shareholder

STMicroelectronics has joined Quintauris GmbH as its sixth shareholder.

Tech Industry Veteran Anders Storm Named Chief Executive Officer of Dirac Research AB

Thirty-year software, engineering, and semiconductor industry veteran brings deep technical knowledge and C-level executive management experience to Dirac.

MEMS & Sensors Executive Congress 2024 to Highlight AI and Sensors Enabling New Applications

Industry visionaries and experts will gather October 7-9 at the MEMS & Sensors Executive Congress (MSEC 2024) at the Château-Bromont Hotel in Bromont, Quebec, Canada for insights into the latest trends and innovations in sensorization.

Unconventional Interface Superconductor Could Benefit Quantum Computing

New material developed by UC Riverside-led team offers promise for developing more scalable and reliable quantum computing components.

Advances in Fiber-Based Wearable Sensors with Machine Learning

The rapid development of artificial intelligence in the past decade has greatly enhanced the ability of wearable devices to process complex data.

New Nano-Device Could Mean Your Run Could Power Your Electrical Wearables

Your early morning run could soon help harvest enough electricity to power your wearable devices, thanks to new nanotechnology developed at the University of Surrey.  

NSF Awards $38M to Strengthen Research Infrastructure

The U.S. National Science Foundation has awarded researchers in Maine, Mississippi, New Mexico, Puerto Rico and Rhode Island roughly $38 million through the Established Program to Stimulate Competitive Research (EPSCoR), which promotes the development of research competitiveness among 28 targeted states and territories, called jurisdictions.

Fujitsu Semiconductor Memory Solution Announces Change in Its Name to RAMXEED LIMITED

Fujitsu Semiconductor Memory Solution Limited is pleased to announce that the company name will change to RAMXEED LIMITED, effective January 1, 2025.

MULTI-DOF Technology from HEIDENHAIN Gives Hybrid Bonding a Boost

While a reduction in production throughput had been an acceptable compromise for smaller structures in previous years, a significant increase in productivity is now back on the agenda of semiconductor manufacturers. HEIDENHAIN encoders with MULTI-DOF TECHNOLOGY unlock these new dimensions of higher accuracy and performance.

Inspired by the Human Body, Engineer Designs Chips that Could Make Wearable AI More Energy Efficient

Is it possible to use artificial intelligence tools like ChatGPT without internet access?

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