mechatronic systemtechnik GmbH (mechatronic), a global supplier of automation equipment for critical wafer handling, announced the opening of its new cutting-edge technology center in Fürnitz.
MEMS
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
Research published in Nature demonstrates high qubit control fidelity and uniformity in single-electron control.
Rogue Valley Microdevices’ Unveils 300mm MEMS Capability at its Upcoming Palm Bay, Florida Facility
CEO Jessica Gomez presents this week at the MEMS & Sensors Technical Congress.
Morse Micro Expands Presence in Taiwan with New Office
Morse Micro today announced the official opening of its new Taiwan branch.
Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
Worldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024.
Design Strategies Toward Plasmon-Enhanced 2-Dimensional Material Photodetectors
A research group from Southeast University provided a detailed overview of plasmon-enhanced 2D material photodetectors, mainly focusing on the clarification of different hybridization modes between plasmonic nanostructures and 2D materials.
Revolutionizing Memory Technology: Multiferroic Nanodots for Low-Power Magnetic Storage
In a significant milestone for multiferroic memory devices, a team of researchers led by Professor Masaki Azuma and Assistant Professor Kei Shigematsu from Tokyo Institute of Technology in Japan has successfully developed nanodots with single ferroelectric and ferromagnetic domains.
Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Silex Announces the First Pure-Play MEMS 12-inch Wafer Fab
Silex today announces the first 12-inch wafer fab for pure-play MEMS manufacturing.
Opening Up the Potential of Thin-Film Electronics for Flexible Chip Design
New research demonstrates feasibility of ‘foundry’ model for flexible electronics.
