The global semiconductor advanced packaging market size is estimated to grow by USD 22.79 billion from 2024 to 2028, according to Technavio.
MEMS
SEMI Issues Statement on Change to U.S. CHIPS Act Notice of Funding Opportunity
SEMI today issued the following statement from Ajit Manocha, SEMI President and CEO, after the United States Government announced it will no longer move forward with the Notice of Funding Opportunity for CHIPS funding for the construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States.
Semiconductor Research Corporation Announces 2024 Call for Research, $13.8M in Funding Opportunities
Semiconductor Research Corporation (SRC) is announcing the start of solicitation season with $13.8 million in funding opportunities.
The Building Block for Magnetoelectric Spin-Orbit Logic
An international team, led by researchers from the Nanodevices group at CIC nanoGUNE, succeeded in voltage-based magnetization switching and reading of magnetoelectric spin-orbit nanodevices.
Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms
Micron’s automotive memory and storage enable central compute, digital cockpit and advanced driver-assistance systems for Qualcomm customers.
Breakthrough in Memory Technology: Next-Generation Optoelectronic Memory with Tellurene
Researchers developed a novel optoelectronic memory device that addresses the issues of conventional floating-gate nonvolatile memory devices.
Everspin Technologies Unveils PERSYST
Everspin Technologies, Inc. announced today the new brand name PERSYST for its persistent memory product family.
Scott Monroe Appointed as Vice President of Sales at Encore Semi
Encore Semi, a provider of tailored engineering solutions to accelerate projects, improve performance, and reduce risks in the development of next generation System-on-Chip (SoC), electronic subsystems, and intellectual property (IP), announced the appointment of Scott Monroe as Vice President of Sales.
Utilizing Palladium for Addressing Contact Issues of Buried Oxide Thin Film Transistors
A novel method that employs palladium to inject hydrogen into the deeply buried oxide-metal electrode contacts of amorphous oxide semiconductors (AOSs) storage devices, which reduces contact resistance, has been developed by scientists at Tokyo Tech.
U.S. Department of Commerce Receives Over 160 Concept Plans for CHIPS for America Funding
Projects to play vital role in strengthening the U.S. semiconductor supply chain.
