Intrinsic ID, the provider of Physical Unclonable Function (PUF) technology field-proven in more than 650 million devices across the globe, today announced that it is now a member of the Intel Foundry Accelerator IP Alliance program to ensure the availability of hardware-based root-of-trust (RoT) solutions for Intel Foundry customers.
MEMS
Ideal Power Successfully Completes Phase II of Development Program with Stellantis
Ideal Power Inc. today announced the successful completion of Phase II deliverables of a product development agreement with Stellantis, a top 10 global automaker.
STMicroelectronics Expands into 3D Depth Sensing With Latest Time-of-Flight Sensors
The world’s smallest iToF sensor with 672×804-pixel resolution, is now in volume production with a first design win at Lanxin Technology.
CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems
CEA-Leti has developed a keyword-spotting system that dramatically improves accuracy in always-on, voice-activated Edge-AI systems and that consumes less power in a far smaller silicon footprint than current technology.
Sony Semiconductor Israel Announces Commercial Availability of the Revolutionary ALT1350 LPWA Chipset
The new ALT1350, a game-changer for asset trackers and smart utility meters, boasts unmatched low power consumption and advanced location capabilities.
UC San Diego and CEA-Leti Report First IC for Piezoelectric Resonator DC-DC Conversion Achieving a 310% Loss Reduction
University of California San Diego and CEA-Leti scientists have developed a ground-breaking piezoelectric-based DC-DC converter that unifies all power switches onto a single chip to increase power density.
Samsung Electronics Collaborates with Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry’s Latest GAA Process Technology
Collaboration accelerates access to newest Arm CPU, enabling new class of SoCs with Generative AI capabilities.
Researchers Invent New Way to Stretch Diamond for Better Quantum Bits
A future quantum network may become less of a stretch, thanks to researchers at the University of Chicago, Argonne National Laboratory and Cambridge University.
SIA Commends CHIPS Act Incentives for GlobalFoundries Projects
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced by the U.S. Department of Commerce and GlobalFoundries.
Cohu Announces Orders for New MEMS Microphone Tester
Cohu, Inc., a global supplier of equipment and services optimizing semiconductor manufacturing yield and productivity, today announced that a leading U.S. fabless semiconductor manufacturer has selected Sense+ system with µ-sense for testing their next generation high-fidelity microphones.
