Silex today announces the first 12-inch wafer fab for pure-play MEMS manufacturing.
MEMS
Opening Up the Potential of Thin-Film Electronics for Flexible Chip Design
New research demonstrates feasibility of ‘foundry’ model for flexible electronics.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
Samsung Electronics Co., Ltd. today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
The 2024 IEEE Symposium on VLSI Technology & Circuits To Showcase Breakthroughs in Microelectronics
For the last 44 years, the IEEE Symposium on VLSI Technology & Circuits has delivered a unique convergence of technology and circuits for the microelectronics industry, with maximum synergy between both domains.
US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C
The U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) program.
Properties of New Materials for Microchips Can Now Be Measured Well
Reseachers of Delft University of Technology demonstrated measuring performance properties of ultrathin silicon membranes.
Plant Sensors Could Act as an Early Warning System for Farmers
Sensors that detect plant signaling molecules can reveal when crops are experiencing too much light or heat, or attack from insects or microbes.
SEMI Applauds CHIPS Program Office Progress to Diversify U.S. Semiconductor Industry Workforce
The report outlines key aspects of the work to execute on Congress’s mandate to advance opportunity and inclusion as it brings back manufacturing and supply chains to the U.S.
Quantum Electronics: Charge Travels Like Light in Bilayer Graphene
An international research team led by the University of Göttingen has demonstrated experimentally that electrons in naturally occurring double-layer graphene move like particles without any mass, in the same way that light travels.
Samsung to Establish Leading-Edge Semiconductor Ecosystem in Central Texas with CHIPS Act Funding
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Samsung Electronics (Samsung) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $6.4 billion in direct funding under the CHIPS and Science Act to strengthen the resilience of the U.S. semiconductor supply chain, advance U.S. technology leadership, and fuel U.S. global competitiveness.
