SEALSQ Corp. today announced the closing of the second tranche of a private placement, amounting to $10 million, which is part of the company’s $20 million private placement pursuant to the securities purchase agreement entered into July 11, 2023 with a select group of institutional investors.
MEMS
Valens Semiconductor and Intel Foundry Services Announce Strategic Relationship for Next Generation A-PHY Product
The strategic collaboration will accelerate adoption of the MIPI A-PHY standard technology for enhanced ADAS and safety boosting the industry’s chiplet vision.
Renesas to Acquire Transphorm to Expand its Power Portfolio with GaN Technology
Acquisition accelerates Renesas’ wide bandgap expertise and roadmap to fast-growing market opportunities for EVs, data centers & AI power, and renewable energy.
Using Berry Phase Monopole Engineering for High-Temperature Spintronic Devices
Spintronic devices are electronic devices that utilize the spin of electrons (an intrinsic form of angular momentum possessed by the electron) to achieve high-speed processing and low-cost data storage.
TI Debuts New Automotive Chips at CES
Texas Instruments today introduced new semiconductors designed to improve automotive safety and intelligence.
National Semiconductor and Advanced Manufacturing Technician Apprenticeship Program Launched to Support State Efforts to Develop Strategic Talent Pipelines
Today the National Institute for Innovation and Technology—the nation’s leader in the semiconductor talent pipeline development and U.S. Department of Labor (USDOL) national Intermediary responsible for establishing and expanding Registered Apprenticeships (RAs) throughout semiconductor and nanotechnology-related industry supply chains—launched the national Semiconductor and Advanced Manufacturing Technician Apprenticeship Program (SAM-TAP).
Low-Cost Microscope Projection Photolithography System for High-Resolution Fabrication
Scientists from the Leibniz University Hannover have developed a low-cost and user-friendly fabrication technique, called UV-LED-based microscope projection photolithography (MPP), for rapid high-resolution manufacturing of optical elements within seconds.
A KAIST Research Team Develops High-Performance Stretchable Solar Cells
A KAIST research team from the Department of Chemical and Biomolecular Engineering (CBE) led by Professor Bumjoon Kim announced the development of a new conductive polymer material that achieved both high electrical performance and elasticity while introducing the world’s highest-performing stretchable organic solar cell.
Biden-Harris Administration Announces CHIPS Preliminary Terms with Microchip Technology
The Biden-Harris Administration announced that the U.S. Department of Commerce and Microchip Technology Inc. have reached a non-binding preliminary memorandum of terms (PMT) to provide approximately $162 million in federal incentives under the CHIPS and Science Act to support the onshoring of the company’s semiconductor supply chain.
Presto Engineering Announces ISO27001 Certification
Presto Engineering announced that it has successfully passed ISO27001 certification, which is the global standard for an effective information security management system.
