New investments in CVD SiC expected from equipment component suppliers.
MEMS
Gold Now Has a Golden Future in Revolutionizing Wearable Devices
A research team led by Professor Sei Kwang Hahn and Dr. Tae Yeon Kim from the Department of Materials Science and Engineering at Pohang University of Science and Technology (POSTECH) developed an integrated wearable sensor device that effectively measures and processes two bio-signals simultaneously.
ALEDIA/France Invests in Additional nTact Coater
nTact announced the sale of a second slot-die-coating machine under controlled atmosphere to ramp up production for ALEDIA/France.
The 2024 IEEE Symposium on VLSI Technology & Circuits Announces Call for Workshop Submissions
The 2024 IEEE Symposium on VLSI Technology & Circuits has announced a Call for Workshop topics in support of the conference theme: “Bridging the Digital & Physical Worlds with Efficiency & Intelligence.”
Akoustis Awarded Phase 2 For DARPA COFFEE Program
Akoustis Technologies, Inc. was awarded a new multi-year, multi-million dollar contract for Phase 2 of the DARPA COmpact Front-end Filters at the ElEment-level (COFFEE) program.
Particle Measuring Systems Receives Silver EcoVadis Medal for Progress on Sustainability
Particle Measuring Systems (PMS), a developer of contamination monitoring solutions, announced that it has been awarded a Silver EcoVadis Medal for its progress toward sustainability.
Imec Grants Public Access to Virtual Fab for Quantifying Environmental Impact of IC Manufacturing
Beyond the ICT industry, imec aims to guide academics and policy makers with actionable data.
TECHCET Announces Call for Papers for 2024 CMC Conference
TECHCET announces an official call for papers for the 9th Annual Critical Materials Council (CMC) Conference taking place on April 10-11, 2024 in Chandler, Arizona.
XTPL Enters Manufacturing Lines of Modern Electronics with its Groundbreaking Ultra-Precise Dispensing Technology
This technology has just become available to the industrial market, offering unprecedented precision in mass production.
Mitsubishi Electric and Nexperia to Partner in Joint SiC Power Semiconductors Development
Developing and supplying SiC chips to Nexperia, implementing the technologies accumulated through SiC power module experiences.
