MEMS

SEMI ISS Europe 2024 to Spotlight European Chips Act With Focus on Innovation and Supply Chain Resilience

Leading analysts, economists, policymakers and technologists will gather at the SEMI Industry Strategy Symposium Europe (ISS Europe) 2024, March 6-8 in Vienna, Austria, for insights into the latest trends and innovations shaping the global semiconductor industry.

Sahmyook University Researchers Open Doors to Next-Generation Memristive Devices

The researchers have addressed challenges in data retention and endurance of these devices by developing a silver-dispersive chalcogenide thin film.

SEALSQ Announces Closing of the Second $10.0 Million Tranche of Convertible Notes and Warrants Private Placement

SEALSQ Corp. today announced the closing of the second tranche of a private placement, amounting to $10 million, which is part of the company’s $20 million private placement pursuant to the securities purchase agreement entered into July 11, 2023 with a select group of institutional investors.

Valens Semiconductor and Intel Foundry Services Announce Strategic Relationship for Next Generation A-PHY Product

The strategic collaboration will accelerate adoption of the MIPI A-PHY standard technology for enhanced ADAS and safety boosting the industry’s chiplet vision.

Renesas to Acquire Transphorm to Expand its Power Portfolio with GaN Technology

Acquisition accelerates Renesas’ wide bandgap expertise and roadmap to fast-growing market opportunities for EVs, data centers & AI power, and renewable energy.

Using Berry Phase Monopole Engineering for High-Temperature Spintronic Devices

Spintronic devices are electronic devices that utilize the spin of electrons (an intrinsic form of angular momentum possessed by the electron) to achieve high-speed processing and low-cost data storage.

TI Debuts New Automotive Chips at CES

Texas Instruments today introduced new semiconductors designed to improve automotive safety and intelligence.

National Semiconductor and Advanced Manufacturing Technician Apprenticeship Program Launched to Support State Efforts to Develop Strategic Talent Pipelines

Today the National Institute for Innovation and Technology—the nation’s leader in the semiconductor talent pipeline development and U.S. Department of Labor (USDOL) national Intermediary responsible for establishing and expanding Registered Apprenticeships (RAs) throughout semiconductor and nanotechnology-related industry supply chains—launched the national Semiconductor and Advanced Manufacturing Technician Apprenticeship Program (SAM-TAP).

Low-Cost Microscope Projection Photolithography System for High-Resolution Fabrication

Scientists from the Leibniz University Hannover have developed a low-cost and user-friendly fabrication technique, called UV-LED-based microscope projection photolithography (MPP), for rapid high-resolution manufacturing of optical elements within seconds.

A KAIST Research Team Develops High-Performance Stretchable Solar Cells​

A KAIST research team from the Department of Chemical and Biomolecular Engineering (CBE) led by Professor Bumjoon Kim announced the development of a new conductive polymer material that achieved both high electrical performance and elasticity while introducing the world’s highest-performing stretchable organic solar cell.

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