New chip design uses special glass to allow interactions between light and sound.
MEMS
GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile
Building on years of collaboration, this new process technology collaboration will provide power-efficient and secure connectivity solutions for essential consumer and industrial applications manufactured both in Europe and the U.S.
HKU Engineering Team Develops Soft Microelectronics Technologies Enabling Wearable AI for Digital Health
Leveraging rapid technological advances for human health is a global trend, driving the rise of biomedical engineering research. A fast-rising field is wearable biosensors, which have the potential to realise digital healthcare and AI medicine.
Gartner Identifies the Top 10 Strategic Technology Trends for 2025
Gartner, Inc. today announced its list of 10 top strategic technology trends that organizations need to explore in 2025. Analysts presented their findings during Gartner IT Symposium/Xpo, taking place here through Thursday.
Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications
Arteris, Inc. today announced an innovative evolution of its network-on-chip (NoC) IP products with tiling capabilities and extended mesh topology support for faster development of Artificial Intelligence (AI) and Machine Learning (ML) compute in system-on-chip (SoC) designs.
SEALSQ and Allion Japan Inc. Partner to Help IoT Device Manufacturers Build Secure, Standard-Compliant Products
The partnership aims to assist IoT device manufacturers in creating secure and standard-compliant products, meeting key protocols such as Matter, and complying with new international IoT security regulations like the EU Cyber Resilience Act (CRA) and the US Cyber Trust Mark.
Samsung Develops Industry’s First 24Gb GDDR7 DRAM for Next-Generation AI Computing
Samsung Electronics Co., Ltd. today announced it has developed the industry’s first 24-gigabit (Gb) GDDR7 DRAM.
Infinera Receives CHIPS and Science Act Funds to Support Development of Semiconductor Technology Important for Communications and National Security
Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHIPS and Science Act.
Forge Nano Receives $10M Investment from GM Ventures
GM plans to utilize Forge Nano’s Atomic Armor surface engineering platform technology to pursue battery cathode material enhancements.
Intel and AMD Form x86 Ecosystem Advisory Group
Intel Corp. and AMD today announced the creation of an x86 ecosystem advisory group bringing together technology leaders to shape the future of the world’s most widely used computing architecture.
