SEMICON West is moving to Phoenix for a five-year annual rotation and shifting from its longstanding July event dates to October beginning in 2025.
MEMS
MEMS & Imaging Sensors Summit to Spotlight Ubiquitous Sensing for Sustainable World
More than 300 industry experts will gather 19-21 September at the SEMI MEMS & Imaging Sensors Summit for insights into the latest MEMS and sensors technology developments and trends key to global sustainability.
A New Milestone for Flexible Magnetic Sensors
A giant leap of more than an order of magnitude improvement in the sensitivity of flexible magneto-resistive sensors heralds new opportunities for flexible sensors in medical devices, soft robotics and more.
Impinj Wins Patent Infringement Lawsuits Against NXP Semiconductors; Jury Awards $18 Million
Impinj, Inc., a RAIN RFID provider and Internet of Things pioneer, today announced that it prevailed in two RAIN RFID patent-infringement lawsuits.
Rapid Fabrication of a Polymer Lens on a Laser Chip for Miniaturized Spectroscopy
Two-photon-polymerization 3D printing is successfully exploited to reduce the divergence of a vertical laser diode to be integrated in a compact optical gas sensor.
STMicroelectronics Begins Volume Production of PowerGaN Devices for Slimmer, Cooler, and More Efficient Power Products
Gallium nitride (GaN)-based products deliver better energy efficiency and enable more compact system designs in consumer, industrial, and automotive applications.
Samsung Starts Mass Production of Automotive UFS 3.1 Memory Solution with Industry’s Lowest Power Consumption
New UFS 3.1 is optimized for IVI systems and consumes 33% less energy, providing added benefits to future automotive applications.
SEMI and Semiconductor Digest Announce 2023 Best of West Award Finalists
SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2023, July 11-13 at the Moscone Center in San Francisco.
SEMICON West 2023 Opens Tomorrow to Showcase Industry Growth to $1 Trillion, Sustainability and Talent
Concurrent with SEMICON West, FLEX Conference 2023 to Spotlight Flexible Hybrid Electronics Innovations.
Applied Materials Advances Heterogeneous Chip Integration with New Technologies for Hybrid Bonding and Through-Silicon Vias
Applied Materials, Inc. today introduced materials, technologies and systems that help chipmakers integrate chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs). The new solutions extend Applied’s industry-leading breadth of technologies for heterogeneous integration (HI).
