xMEMS Labs today announced general availability of three revolutionary solutions for immediate integration into next-generation true wireless (TWS) earphones, in-ear-monitors (IEMs), digital hearing aids, and other emerging personal audio electronics, including smart glasses and sleep buds.
MEMS
Cellcom Telecommunications Israel Plans to Roll Out Independent 5G Network
Cellcom Telecommunications Israel and Parallel Wireless Inc are launching a unique, first-of-its-kind experiment to deploy a standalone 5th generation (5G SA) network for autonomous 5G.
KAIST Team Develops Highly-Sensitive Wearable Piezoelectric Blood Pressure Sensor
A KAIST research team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering and the College of Medicine of the Catholic University of Korea has developed a highly sensitive, wearable piezoelectric blood pressure sensor.
Novel, Highly Sensitive Biosensor Set to Transform Wearable Health Monitoring
Researchers from Japan have developed a new wearable biosensor that can detect extremely small changes in tear glucose and blood lactate levels.
Scientists Create High-Efficiency Sustainable Solar Cells for IoT Devices with AI-Powered Energy Management
Newcastle University researchers have created environmentally-friendly, high-efficiency photovoltaic cells that harness ambient light to power internet of Things (IoT) devices.
Magnachip to Appoint Shareholder Gilbert Nathan to the Board of Directors
Magnachip Semiconductor Corporation announced today that shareholder Gilbert Nathan will join its Board of Directors pursuant to the terms of an agreement entered into with Mr. Nathan and two of his affiliated entities.
GigaDevice’s Industry-Leading Automotive Flash Memory Achieves 100 Million Units Shipment Milestone
GigaDevice, a semiconductor industry leader in flash memory, 32-bit microcontrollers (MCUs), sensors, and analog technology, announces the milestone of shipping 100 million units of its leading automotive-grade (AEC-Q100) GD25/55 SPI NOR and GD5F SPI NAND flash series.
ZF Signs Multi-Year Supply Agreement with STMicroelectronics for Silicon Carbide Devices
The technology group ZF will, from 2025, purchase silicon carbide devices from STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications.
SiTime Delivers Precision Timing Solution for Industry Leading Low Power FPGAs from Lattice Semiconductor
The SiTime devices, a Cascade MEMS-based Clock-System-on-a-Chip (ClkSoC) and an Emerald OCXO or Elite X Super-TCXO, are incorporated into Lattice’s new synchronization hardware development platform.
Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design
Intel Foundry Services (IFS) and Arm today announced a multigeneration agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process.
