DTU researchers raise fundamental questions about the proposed value of topological protection against backscattering in integrated photonics.
MEMS
3D-Micromac Shortens Atom Probe Tomography Sample Prep Time From Hours to Minutes With New Laser Micromachining System
3D-Micromac AG today introduced the microPREP PRO FEMTO laser micromachining system for high-speed Atom Probe Tomography (APT) and cross-section sample preparation.
New SEMI Europe-Led Consortium Wins Funding to Help Overcome Europe’s Microelectronics Industry Skills and Talent Shortage
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today announced that SEMI Europe, as the lead of a new 18-partner consortium, has won up to €4 million in funding to develop the European Chips Skills Academy, an initiative to help tackle the skills and talent shortages in Europe’s electronics industry and propel its long-term growth.
Women in Semiconductors 2023 to Highlight Bridging the Gender Gap Through Allyship
The vital importance of workplace inclusion and diversity to the growth of the global semiconductor industry will take center stage as the Women in Semiconductors (WiS) program returns in-person on May 1 in conjunction with the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2023) in Saratoga Springs, New York.
GlobalFoundries Engineer Receives $50,000 Award for Groundbreaking Technology Advances in Inaugural GFX Prize Program
Additional innovation winners announced for 2023 Master Inventors and DE&I in Inventorship Champion.
Mark Lewis Named Inaugural CEO of Purdue Applied Research Institute
Purdue University announced Tuesday (April 11) the hire of Mark Lewis as the first chief executive officer of the Purdue Applied Research Institute (PARI), the nonprofit applied research arm of Purdue with a particular focus on national security, economic security and food security for the United States.
Samsung Electronics and AMD Extend Strategic IP Licensing Agreement
Samsung Electronics Co., Ltd. and AMD today announced they have signed a multi-year agreement extension to bring multiple generations of high-performance, ultra-low-power AMD Radeon graphics solutions to an expanded portfolio of Samsung Exynos SoCs.
Wise-integration & Powernet Team Up to Deliver Digitally Controlled, Compact, Energy-Efficient GaN Power Supply Systems
Wise-integration, a French pioneer in digital control of gallium nitride (GaN) power supplies and GaN ICs, and Powernet, a Korean power supply manufacturer, today announced an agreement to build compact and energy-efficient technology for power-supply applications that are currently limited to analog control.
SEMIFIVE Achieves Mass Production Milestone of its SoC Platform
SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, announced it has begun mass production of its first SoC Platform-based AI chip product built on Samsung Foundry’s matured 14nm FinFET technology.
Rapidus, Japan’s Newly Founded Chip Manufacturer, Joins imec’s Core Partner Program
Imec and Rapidus, Japan’s newly founded chip manufacturer, today announced that they have taken an important next step in setting up a long-term and sustainable collaboration in the domain of advanced semiconductor research, with Rapidus joining imec’s Core Partner Program.
