The MEMS market is estimated to be valued at US$ 23,858 million in 2021 and is expected to exhibit a CAGR of 8.23% during the forecast period (2023-2030).
MEMS
FUJIFILM Electronic Materials, U.S.A., Inc. Invests in Enhanced Sustainability for its Mesa, Ariz. Campus
FUJIFILM Electronic Materials, U.S.A., Inc., announced today key sustainability initiatives designed to increase the organization’s commitment to sustainable business practices, including solar panel installation and water conservation measures.
IDTechEx Discusses The Tantalizing Potential for GaN in Electric Vehicle Power Electronics
As electric vehicle (EV) power electronics undergoes a paradigm shift towards wide bandgap (WBG) semiconductors, it is clear that silicon carbide (SiC) is becoming the material of choice, while gallium nitride (GaN) is often shoe-boxed into telecommunications or optoelectronics applications.
Global High Bandwidth Memory Market to Hit Sales of US$ 3,433.8 Million by 2031
The global high bandwidth memory market is projected to reach US$ 3,433.8 million by 2031 up from US$ 292.7 million in 2022, at a CAGR of 31.3% during the forecast period 2023-2031.
Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports
The 2023 decline will stem from weakening chip demand and higher inventory of consumer and mobile devices.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
Commerce Department Outlines Proposed National Security Guardrails for CHIPS for America Incentives Program
Guardrails will ensure innovations and technology funded by CHIPS Act bolsters technological and national security for America and our allies.
memsstar to Support Walther-Meißner-Institut in Developing Next-Generation Quantum Devices
memsstar Ltd., a provider of etch and deposition equipment to researchers and manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), today announced it has shipped its ORBIS Alpha XERIC oxide etch system for MEMS research and manufacturing to Germany’s Walther-Meißner-Institut for Low-Temperature Research (WMI).
Samsung Announces Ultra-Wideband Chipset with Centimeter-Level Accuracy for Mobile and Automotive Devices
Samsung Electronics Co., Ltd. today announced its first ultra-wideband (UWB) chipset, the Exynos Connect U100. With single-digit centimeter accuracy, the new UWB solution is optimized for use in mobile, automotive and Internet of Things (IoT) devices, offering precise distance and location information.
New MPLAB SiC Power Simulator Allows Customers to Test Microchip’s SiC Power Solutions in Design Phase
The electrification of everything is driving the growth of SiC semiconductors as large market segments such as E-Mobility, sustainability and industrial turn to SiC power solutions because of its fast-switching capabilities, lower power loss and higher temperature performance.
