MEMS

MIT Engineers Grow “Perfect” Atom-Thin Materials on Industrial Silicon Wafers

Their technique could allow chip manufacturers to produce next-generation transistors based on materials other than silicon.

Two Technical Breakthroughs Make High-Quality 2D Materials Possible

Work by Sang-Hoon Bae, collaborators would make next-generation electronics faster, use less power.

Wearable, Printable, Shapeable Sensors Detect Pathogens and Toxins in the Environment

Tufts scientists develop biopolymer-based sensors that glow when dangers are present and can be printed on almost anything—masks, gloves, clothing, food jars, or shaped into flying objects.

Global Semiconductor Sales Decrease 2.9% Month-to-Month in November

Worldwide chip sales down 9.2% year-to-year.

Chiplet Summit Promotes Higher Design Productivity at Leading-Edge Nodes

Chiplet Summit, to be held January 24-26 at the Doubletree by Hilton San Jose Hotel, will help designers go-to-market faster by using the latest design architecture – chiplets.

Ambiq Named IoT Semiconductor of the Year in IoT Breakthrough Awards for the 2nd Time

Ambiq today announced that, for the second time, it has been selected as the winner of the “IoT Semiconductor Company of the Year” award in the seventh annual IoT Breakthrough Awards program conducted by IoT Breakthrough.

IDTechEx Discusses What to Expect From the Graphene Industry in 2023

Is this the year of rapid graphene sales? Are we slipping deeper into a disillusionment phase? Who will emerge as the market leaders? Is consolidation inevitable? 2023 will be a telling year for the industry.

Arteris Acquires Semifore to Accelerate System-on-Chip Development

Augmenting leading network-on-chip IP and IP deployment automation with the leading hardware/software interface automation solution.

STPOWER Automotive-Grade Devices from STMicroelectronics Run Cooler in Surface-Mount ACEPACK SMIT Package

STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST’s advanced ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages.

Seeing Machines, Ambarella and Autobrains Offer Combined Front ADAS and Driver Monitoring Solution in Single Box, Using Single System-on-Chip

Autobrains Technologies Ltd., Ambarella, Inc. and Seeing Machines Limited today announced a strategic collaboration to offer three safety systems in a single box, using a single system-on-chip (SoC).

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