A team led by USC, MIT, and the University of Massachusetts, developed a protocol for devices to reduce “noise” and demonstrated the practicality of using this protocol in integrated chips.
MEMS
Micross Celebrates the Grand Opening of its New Flagship Semiconductor and Specialty Electronics Manufacturing Facility in Apopka, FL
Micross Components, Inc. celebrated the grand opening of its new 85,000 sq. ft. flagship semiconductor and specialty electronics manufacturing facility in Apopka, FL, on March 20, 2023.
New Resources for CHIPS Applicants
Today, the Department of Commerce is releasing pre-application and application instructions, guidebooks, and other resources for the first CHIPS for America funding opportunity for leading-edge, current-generation, mature-node, and back-end semiconductor fabrication facilities.
Park Systems Introduces Park NANOstandard for Traceable Calibration Standards
Park Systems, a provider of Atomic Force Microscopy (AFM) and nano-metrology solutions, announced the launch of its Park NANOstandard product line.
Gordon Moore, Intel Co-Founder, Dies at 94
Intel and the Gordon and Betty Moore Foundation announced that company co-founder Gordon Moore died on March 24, 2023, at the age of 94.
Ruggedness of Cambridge GaN Devices’ ICeGaN Technology Proven in Virginia Tech Paper at APEC
70 V over-voltage capability combines with intelligent on-chip protection to deliver highest GaN reliability and ruggedness.
MEMS Market to Surpass US$ 48,595.4 Million by 2030, Says Coherent Market Insights
The MEMS market is estimated to be valued at US$ 23,858 million in 2021 and is expected to exhibit a CAGR of 8.23% during the forecast period (2023-2030).
FUJIFILM Electronic Materials, U.S.A., Inc. Invests in Enhanced Sustainability for its Mesa, Ariz. Campus
FUJIFILM Electronic Materials, U.S.A., Inc., announced today key sustainability initiatives designed to increase the organization’s commitment to sustainable business practices, including solar panel installation and water conservation measures.
IDTechEx Discusses The Tantalizing Potential for GaN in Electric Vehicle Power Electronics
As electric vehicle (EV) power electronics undergoes a paradigm shift towards wide bandgap (WBG) semiconductors, it is clear that silicon carbide (SiC) is becoming the material of choice, while gallium nitride (GaN) is often shoe-boxed into telecommunications or optoelectronics applications.
Global High Bandwidth Memory Market to Hit Sales of US$ 3,433.8 Million by 2031
The global high bandwidth memory market is projected to reach US$ 3,433.8 million by 2031 up from US$ 292.7 million in 2022, at a CAGR of 31.3% during the forecast period 2023-2031.
